公开(公告)号：US08872532B2

公开(公告)日：2014-10-28

申请号：US12979200

申请日：2010-12-27

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/00 ,  G01R1/04 ,  G01R31/302

CPC classification number: G01R1/0491 ,  G01R31/3025

Abstract: Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.

Abstract translation: 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。

公开(公告)号：US08760187B2

公开(公告)日：2014-06-24

申请号：US12327576

申请日：2008-12-03

Applicant: Eric D. Hobbs

Inventor： Eric D. Hobbs

IPC: G01R31/20

CPC classification number: G01R31/2889

Abstract: A first device and a second device can include at least one alignment feature and at least one corresponding constraint. The alignment feature and the constraint can be configured to align the first device and the second device when the alignment feature is inserted into the constraint. The alignment feature and the constraint can be further configured to direct relative movement between the first device and the second device due to relative thermal expansion or contraction between the first device and the second device. The directed relative movement can keep the first device and the second device aligned over a predetermined temperature range.

Abstract translation: 第一装置和第二装置可以包括至少一个对准特征和至少一个对应的约束。 对准特征和约束可以被配置为当对准特征被插入到约束中时，使第一设备和第二设备对齐。 对准特征和约束可以被进一步配置成由于第一装置和第二装置之间的相对热膨胀或收缩而引导第一装置和第二装置之间的相对运动。 定向相对运动可以使第一装置和第二装置保持在预定的温度范围内。

公开(公告)号：US08736294B2

公开(公告)日：2014-05-27

申请号：US12967302

申请日：2010-12-14

Applicant: Kevin S. Chang ,  Eric D. Hobbs

Inventor： Kevin S. Chang ,  Eric D. Hobbs

IPC: G01R31/00

CPC classification number: G01R1/07378 ,  G01R31/2891

Abstract: A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly.

Abstract translation: 用于探针卡组件的加强件可以包括设置在加强件的径向臂内的解耦机构。 去耦机构可以沿着所述径向臂的径向的方向并且在垂直于所述径向臂的方向上是刚性的。 解耦机构可以将加强件与加热元件相对于加强件安装到的卡座上的热引起的差分径向收缩和膨胀相分离。 这可以减少探针卡组件的热诱导垂直平移。

公开(公告)号：US08587331B2

公开(公告)日：2013-11-19

申请号：US12979159

申请日：2010-12-27

Applicant: Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

Inventor： Tommie E. Berry ,  Keith J. Breinlinger ,  Eric D. Hobbs ,  Marc Loranger ,  Alexander H. Slocum ,  Adrian S. Wilson

IPC: G01R31/00

CPC classification number: G01R31/2891

Abstract: Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.

Abstract translation: 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

公开(公告)号：US20120242363A1

公开(公告)日：2012-09-27

申请号：US13288925

申请日：2011-11-03

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

IPC: G01R1/067 ,  H01R43/16 ,  H01R24/66 ,  G01R31/26 ,  H01R24/00 ,  H01R13/02

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  H01R13/2407 ,  H01R43/16 ,  Y10T29/49204

Abstract: An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

Abstract translation: 导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。 每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。 在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且 然后在所述力大于屈曲力时弯曲。

公开(公告)号：US08269514B2

公开(公告)日：2012-09-18

申请号：US12547454

申请日：2009-08-25

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

IPC: G01R31/20

CPC classification number: G01R1/06761 ,  G01R31/2863

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract translation: 本发明的实施例可以涉及用于其中的探针卡组件，多层支撑衬底以及设计用于探针卡组件的多层支撑衬底的方法。 在一些实施例中，探针卡组件可以包括被设计成基本匹配参考材料在所需温度范围内的热膨胀的多层支撑衬底; 以及耦合到多层支撑衬底的探针衬底。 在一些实施例中，参考材料可以是硅。

公开(公告)号：US07977956B2

公开(公告)日：2011-07-12

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/00 ,  G01R31/20

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。

公开(公告)号：US07843202B2

公开(公告)日：2010-11-30

申请号：US11864690

申请日：2007-09-28

Applicant: Eric D. Hobbs ,  Nobuhiro Kawamata ,  Andrew W. McFarland ,  Carl V. Reynolds ,  Yoichi Urakawa

Inventor： Eric D. Hobbs ,  Nobuhiro Kawamata ,  Andrew W. McFarland ,  Carl V. Reynolds ,  Yoichi Urakawa

IPC: G01R31/02

CPC classification number: G01R31/2863 ,  G01R31/2889 ,  G01R31/31905

Abstract: Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.

Abstract translation: 本文提供了测试半导体器件的方法和装置。 在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件与布置在热障下方的探针卡组件的部分之间的热传递。

公开(公告)号：US20100271062A1

公开(公告)日：2010-10-28

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/02

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一组一个或多个特征的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准

公开(公告)号：US07772863B2

公开(公告)日：2010-08-10

申请号：US12327643

申请日：2008-12-03

Applicant: Keith J. Breinlinger ,  Eric D. Hobbs

Inventor： Keith J. Breinlinger ,  Eric D. Hobbs

IPC: G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Abstract translation: 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。