发明申请
- 专利标题: Motherboard
- 专利标题(中): 母板
-
申请号: US11309887申请日: 2006-10-17
-
公开(公告)号: US20080089032A1公开(公告)日: 2008-04-17
- 发明人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- 申请人: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- 申请人地址: TW Tu-Cheng
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW Tu-Cheng
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.
公开/授权文献
信息查询