Circuit board layout method
    1.
    发明授权
    Circuit board layout method 失效
    电路板布局方法

    公开(公告)号:US08256111B2

    公开(公告)日:2012-09-04

    申请号:US12645303

    申请日:2009-12-22

    IPC分类号: H05K3/02 H05K3/10

    摘要: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.

    摘要翻译: 布线电路板的方法包括以下步骤。 衬底板形成有多个板侧。 提供包括多个瓦片的接地平面。 每个接地迹线瓦片由多个接地迹线限定。 衬底板上的信号平面具有包括多个直线段的多个信号迹线。 每个瓦片的任何一个接地迹线相对于一个确定的电路板侧以非零度的角度布置。 直线段被施加以映射在跨越由瓦片的接地轨迹和瓦片的相邻对角线确定的角度范围内的一个瓦片的一个接地轨迹的接地平面上。 一个接地迹线和直线段以可在22.5°至32.5°的范围内的角度施加。

    Printed circuit board
    2.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号:US07973244B2

    公开(公告)日:2011-07-05

    申请号:US11765453

    申请日:2007-06-20

    IPC分类号: H05K1/03

    摘要: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

    摘要翻译: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上,使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

    Motherboard configured to minimize or prevent damage to a chip thereon
    3.
    发明授权
    Motherboard configured to minimize or prevent damage to a chip thereon 失效
    配置为最小化或防止其上的芯片损坏的主板

    公开(公告)号:US07447039B2

    公开(公告)日:2008-11-04

    申请号:US11309887

    申请日:2006-10-17

    IPC分类号: H05K1/00

    摘要: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

    摘要翻译: 主板包括电路板,第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔,用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线,另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击,可以有效地最小化或防止对芯片的损坏。

    Motherboard
    5.
    发明授权
    Motherboard 失效
    母板

    公开(公告)号:US08154879B2

    公开(公告)日:2012-04-10

    申请号:US11849306

    申请日:2007-09-03

    摘要: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

    摘要翻译: 主板包括平行布置在印刷电路板上的印刷电路板,第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击,则可以有效地最小化或防止对芯片的损坏。

    Feeding mechanism for pickup head
    6.
    发明申请
    Feeding mechanism for pickup head 失效
    拾取头的送料机构

    公开(公告)号:US20070202712A1

    公开(公告)日:2007-08-30

    申请号:US11309868

    申请日:2006-10-16

    IPC分类号: H01R12/00

    CPC分类号: G11B7/08582

    摘要: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

    摘要翻译: 一种示例性的光盘驱动装置,包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体,并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽,在其上部较窄,并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面,延长了其使用寿命。

    Method and apparatus for compensating S-parameters of passive circuits
    7.
    发明授权
    Method and apparatus for compensating S-parameters of passive circuits 有权
    用于补偿无源电路S参数的方法和装置

    公开(公告)号:US07996169B2

    公开(公告)日:2011-08-09

    申请号:US12124782

    申请日:2008-05-21

    CPC分类号: G01R27/32 G01R35/00

    摘要: The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S′], wherein matrix S′ is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S′], and choosing an eigenvalue Ψ whose real part real(Ψ) is the biggest; (4) computing a compensating value ξ, the compensating value ξ being equal to real(Ψ)1/2×(1+ε), wherein the ε is a very small positive number; and (5) dividing each of the S-parameters by the compensating value ξ to get the compensated S-parameters.

    摘要翻译: 本发明涉及一种用于补偿不满足被动无源电路的S参数的方法和电路。 该方法包括以下步骤:(1)获得不满足被动的S参数,这些S参数由S参数矩阵S组成; (2)计算矩阵[S×S'],其中矩阵S'是S参数矩阵S的复共轭转置矩阵; (3)计算矩阵的特征值[S×S'],并选择其实部实数(Ψ)最大的特征值Ψ; (4)计算补偿值&xgr;补偿值&xgr; 等于实数(Ψ)1/2×(1 +&egr)),其中& 是一个非常小的正数; 和(5)将每个S参数除以补偿值&xgr; 以获得补偿的S参数。

    Circuit board with improved ground plane
    8.
    发明授权
    Circuit board with improved ground plane 失效
    电路板具有改进的接地平面

    公开(公告)号:US07663063B2

    公开(公告)日:2010-02-16

    申请号:US11737147

    申请日:2007-04-19

    IPC分类号: H05K1/03

    摘要: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

    摘要翻译: 提供电路板用于改善信号质量,包括布置在其上的多个信号迹线的信号平面和由阵列中彼此连接的多个瓦片形成的接地平面。 每个瓷砖由地面痕迹形成。 映射在接地平面上的信号迹线的不同线段以相似的角度交叉瓦片的接地迹线,从而最小化接地迹线和信号迹线之间的相互作用,以减少信号迹线的阻抗的差异。

    Feeding mechanism for pickup head
    9.
    发明授权
    Feeding mechanism for pickup head 失效
    拾取头的送料机构

    公开(公告)号:US07451466B2

    公开(公告)日:2008-11-11

    申请号:US11309868

    申请日:2006-10-16

    IPC分类号: G11B7/085

    CPC分类号: G11B7/08582

    摘要: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

    摘要翻译: 一种示例性的光盘驱动装置,包括构造成可移动地支撑拾取头的引导轴和可弹性变形的构件。 弹性变形构件包括主体,并且悬臂从主体的前边缘的中间部分倾斜。 悬臂在其下部较宽,在其上部较窄,并且悬臂用于弹性地按压导向轴的相应端。 可弹性变形的构件减小了悬臂与引导轴之间的应力表面,延长了其使用寿命。

    Motherboard
    10.
    发明申请
    Motherboard 失效
    母板

    公开(公告)号:US20080089032A1

    公开(公告)日:2008-04-17

    申请号:US11309887

    申请日:2006-10-17

    IPC分类号: H05K7/20

    摘要: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

    摘要翻译: 主板包括电路板,第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔,用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线,另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击,可以有效地最小化或防止对芯片的损坏。