发明申请
US20080090185A1 Method and apparatus for rinsing a substrate during lithographic development processing
审中-公开
用于在光刻显影处理期间漂洗基底的方法和装置
- 专利标题: Method and apparatus for rinsing a substrate during lithographic development processing
- 专利标题(中): 用于在光刻显影处理期间漂洗基底的方法和装置
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申请号: US11906748申请日: 2007-10-02
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公开(公告)号: US20080090185A1公开(公告)日: 2008-04-17
- 发明人: Masahiko Harumoto , Akira Yamaguchi , Akhiro Hisai
- 申请人: Masahiko Harumoto , Akira Yamaguchi , Akhiro Hisai
- 申请人地址: JP Kyoto
- 专利权人: SOKUDO CO., LTD.
- 当前专利权人: SOKUDO CO., LTD.
- 当前专利权人地址: JP Kyoto
- 优先权: JP2006-272558 20061004
- 主分类号: G03F7/26
- IPC分类号: G03F7/26
摘要:
The invention provides a method capable of eliminating occurrence of concentration difference in developer depending on position on a substrate surface when a developer on the substrate is replaced with a rinse; preventing occurrence of stain-like defects on a resist film surface; and reducing amount used of the developer. While a substrate is being rotated about a vertical axis by a rotation motor with held in a horizontal posture by a spin chuck, after the developer has been fed onto the resist film on the substrate surface from a developer discharge nozzle to conduct processing, the substrate continues to be rotated and thus the developer on the resist film is dispersed by a centrifugal force to be removed, and thereafter a rinse is fed onto the resist film from a rinse discharge nozzle to conduct rinsing.
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