公开(公告)号：US08851769B2

公开(公告)日：2014-10-07

申请号：US14132592

申请日：2013-12-18

申请人： Koji Kaneyama

发明人： Koji Kaneyama

IPC分类号： G03D5/00 ,  B05C13/02 ,  G03B27/58 ,  H01L21/677 ,  H01L21/687 ,  H01L21/67 ,  G03F7/20

CPC分类号： G03F7/70975 ,  G03B27/58 ,  G03F7/70741 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67745 ,  H01L21/68707 ,  Y10S134/902

摘要： A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.

摘要翻译： 一种用于在其顶表面上具有感光膜的基板的基板处理方法，包括在形成感光膜之后和曝光处理之前清洁基板的背面; 将基板传送到诸如冷却单元的温度调节器，同时用第一保持器保持基板; 用温度调节器调节基板的温度; 将所述基板从所述温度调节器传送到具有第二保持器的所述曝光装置; 以及在曝光处理之后将所述基板传送到第一平台，同时用第三保持器保持所述基板。

公开(公告)号：US08827621B2

公开(公告)日：2014-09-09

申请号：US13042742

申请日：2011-03-08

申请人： Yukihiko Inagaki ,  Kensaku Onishi ,  Jun Yamamoto

发明人： Yukihiko Inagaki ,  Kensaku Onishi ,  Jun Yamamoto

IPC分类号： B65G65/00

CPC分类号： H01L21/67769 ,  B65G1/0407 ,  H01L21/67733 ,  H01L21/67766

摘要： In a substrate processing apparatus, a storage device, an indexer block, a processing block and an interface block are arranged to line up in this order. The storage device includes a plurality of openers on which a carrier storing a plurality of substrates can be placed. The carrier is carried in the storage device. In the storage device, the carrier is transported among the plurality of openers by a transport device. The transport device includes first and second hands configured to be able to hold the carrier and move in a horizontal direction and a vertical direction. The second hand is provided below the first hand.

摘要翻译： 在基板处理装置中，按照该顺序排列存储装置，分度块，处理块和接口块。 存储装置包括多个开放器，可以放置存储多个基板的载体。 载体被携带在存储装置中。 在存储装置中，通过运送装置在多个开放装置之间运送载体。 输送装置包括构造成能够保持载体并沿水平方向和垂直方向移动的第一和第二手。 第二只手是第二只手。

公开(公告)号：US08708587B2

公开(公告)日：2014-04-29

申请号：US14011993

申请日：2013-08-28

申请人： Sokudo, Co., Ltd.

发明人： Hiroyuki Ogura ,  Kenya Morinishi ,  Tsuyoshi Mitsuhashi ,  Yasuo Kawamatsu ,  Yoshiteru Fukutomi ,  Hiromichi Nagashima

IPC分类号： G03D5/00

CPC分类号： B05C13/00 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225

摘要： The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.

摘要翻译： 本发明提供涂覆单元，热处理单元和用于将基底输送到这些处理单元中的每一个的第一主输送机构。 基板通过接收器从第一主输送机构传送到第二主输送机构。 当基板不能放置在接收器上时，将该基板放置在缓冲器上。 因此，第一主输送机构可以继续输送其它基板。 处理单元中的其它基材在处理单元之间没有延迟地输送，以接收包括涂覆处理和热处理的一系列处理。 这防止了在基板上形成膜的处理质量的降低。

公开(公告)号：US08540824B2

公开(公告)日：2013-09-24

申请号：US12813251

申请日：2010-06-10

申请人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

发明人： Koji Kaneyama ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori ,  Shuichi Yasuda

IPC分类号： B08B3/00 ,  H01L21/31 ,  G03F7/00 ,  G03F1/00

CPC分类号： G03F7/70991 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178

摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。

公开(公告)号：US08286576B2

公开(公告)日：2012-10-16

申请号：US12242296

申请日：2008-09-30

申请人： Osamu Tamada ,  Masakazu Sanada ,  Tadashi Miyagi

发明人： Osamu Tamada ,  Masakazu Sanada ,  Tadashi Miyagi

IPC分类号： B05C11/02 ,  B05C11/00 ,  B05B1/28 ,  C23C16/00

CPC分类号： H01L21/6715 ,  G03F7/16

摘要： A thermal processing unit of a thermal processor for anti-reflection films includes: a covering nozzle for covering a substrate from above supported by a thermal processing plate and discharging an adhesion enhancing agent to a periphery of a substrate supported by the thermal processing plate; and a vaporization processor for supplying an adhesion enhancing agent in the vapor phase to the covering nozzle. While a substrate placed over the thermal processing plate is being subjected to thermal process, a control part causes the covering nozzle to discharge an adhesion enhancing agent in the vapor phase onto a periphery of a substrate to realize adhesion enhancement process. Thus, the adhesion between a resist coating film and a substrate surface in the periphery of a substrate is enhanced. Further, parallel implementation of thermal process and adhesion enhancement process exerts no influence on throughput.

摘要翻译： 用于防反射膜的热处理器的热处理单元包括：覆盖喷嘴，用于从由热处理板支撑的上方覆盖基板，并将粘附增强剂排放到由热处理板支撑的基板的周边; 以及用于将气相中的粘附增强剂供给到覆盖喷嘴的蒸发处理器。 当放置在热处理板上的基板经受热处理时，控制部分使得覆盖喷嘴将气相中的粘附增强剂排出到基板的周边上，以实现粘附增强过程。 因此，增强了抗蚀剂涂膜与基板周边的基板表面之间的粘合性。 此外，热处理和附着增强过程的并行实施对生产量没有影响。

公开(公告)号：US08166985B2

公开(公告)日：2012-05-01

申请号：US12267535

申请日：2008-11-07

申请人： Koji Nishiyama ,  Hiroshi Yoshii

发明人： Koji Nishiyama ,  Hiroshi Yoshii

IPC分类号： B08B3/00

CPC分类号： H01L21/67173 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/68728 ,  H01L21/68742 ,  Y10S134/902

摘要： When a substrate is subjected to bevel cleaning processing, a first magnet plate is arranged at a lower position, and a second magnet plate is arranged at an upper position. In this case, each of chuck pins enters a closed state in a region outside the first magnet plate, while entering an opened state in a region outside the second magnet plate. That is, a holder in each of the chuck pins is maintained in contact with an outer edge of the substrate when it passes through the region outside the first magnet plate, while being spaced apart from the outer edge of the substrate when it passes through the region outside the second magnet plate.

摘要翻译： 当对基板进行斜面清洁处理时，第一磁体板布置在下部位置，第二磁体板布置在上部位置。 在这种情况下，每个卡盘销在第一磁体板外部的区域中进入关闭状态，同时在第二磁体板外部的区域中进入打开状态。 也就是说，每个卡盘销中的保持器当其穿过第一磁体板外部的区域时与基板的外边缘保持接触，同时当其穿过基板的外边缘时，与基板的外边缘间隔开 区域。

公开(公告)号：US08127713B2

公开(公告)日：2012-03-06

申请号：US12334156

申请日：2008-12-12

申请人： Eric B. Britcher ,  Yevgeniy Rabinovich ,  Svetlana Sherman ,  Masami Ohtani

发明人： Eric B. Britcher ,  Yevgeniy Rabinovich ,  Svetlana Sherman ,  Masami Ohtani

IPC分类号： B05C11/00

CPC分类号： H01L21/6719 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/68771 ,  Y10T29/41

摘要： An apparatus for dispensing fluid during semiconductor substrate processing operations comprises an enclosure having a first side and a second side. The enclosure comprises a first processing station and a second processing station. The second processing station is positioned adjacent to the first processing station. In addition, the substrate processing apparatus includes a first dispense arm configured to deliver a fluid to the first processing station wherein the first dispense arm is positioned between the first side and the first processing station and a second dispense arm configured to deliver the fluid to the second processing station wherein the second dispense arm is positioned between the second side and the second processing station. The substrate processing apparatus also comprises a first rinse arm configured to deliver a rinsing fluid to the first processing station and a second rinse arm configured to deliver the rinsing fluid to the second processing station.

摘要翻译： 在半导体衬底处理操作期间用于分配流体的设备包括具有第一侧和第二侧的外壳。 外壳包括第一处理站和第二处理站。 第二处理站位于第一处理站附近。 此外，基板处理装置包括：第一分配臂，被配置为将流体输送到第一处理站，其中第一分配臂位于第一侧和第一处理站之间，第二分配臂被配置为将流体输送到 第二处理站，其中第二分配臂位于第二侧和第二处理站之间。 衬底处理设备还包括构造成将冲洗流体输送到第一处理站的第一冲洗臂和被构造成将冲洗流体输送到第二处理站的第二冲洗臂。

公开(公告)号：US08031324B2

公开(公告)日：2011-10-04

申请号：US12031667

申请日：2008-02-14

申请人： Yoshiteru Fukutomi ,  Masami Ohtani

发明人： Yoshiteru Fukutomi ,  Masami Ohtani

IPC分类号： G03B27/52 ,  G03D5/00

CPC分类号： H01L21/68764 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/68707 ,  H01L21/68728

摘要： In a substrate processing apparatus, an indexer block, a resist film processing block, a cleaning/drying processing block, a development processing block, and an interface block are provided side by side in this order. An exposure device is arranged adjacent to the interface block. The exposure device subjects a substrate to exposure processing by means of a liquid immersion method. Substrate platforms are provided in close proximity one above the other between the cleaning/drying processing block and the development processing block for receiving and transferring the substrate therebetween. Reversing units that reverse one surface and the other surface of the substrate are respectively stacked above and below the substrate platforms.

摘要翻译： 在基板处理装置中，按顺序并排设置分度器块，抗蚀剂膜处理块，清洁/干燥处理块，显影处理块和界面块。 曝光装置设置在接口块附近。 曝光装置通过液浸法对基板进行曝光处理。 在清洁/干燥处理块和用于在其间接收和转移基板的显影处理块之间彼此靠近地提供基板平台。 将基板的一个表面和另一个表面相反的反转单元分别堆叠在基板平台的上方和下方。

公开(公告)号：US07831135B2

公开(公告)日：2010-11-09

申请号：US11849978

申请日：2007-09-04

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： A21B2/00 ,  A21B1/00 ,  C23C16/00

CPC分类号： H01L21/67248 ,  F27B17/0025

摘要： A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The method also includes determining a difference between the face plate temperature and a predetermined temperature and modifying the temperature control signal provided to the bake plate in response to the determined difference.

摘要翻译： 设置在具有与烘烤板相对的面板的半导体处理室中的烘烤板的操作方法包括向烘烤板提供温度控制信号并测量与面板相关联的面板温度。 该方法还包括确定面板温度和预定温度之间的差异，并且响应于所确定的差异来修改提供给烘烤板的温度控制信号。

公开(公告)号：US20100190116A1

公开(公告)日：2010-07-29

申请号：US12754872

申请日：2010-04-06

申请人： Koji Kaneyama ,  Akihiro Hisai ,  Toru Asano ,  Hiroshi Kobayashi ,  Tsuyoshi Okumura ,  Shuichi Yasuda ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori

发明人： Koji Kaneyama ,  Akihiro Hisai ,  Toru Asano ,  Hiroshi Kobayashi ,  Tsuyoshi Okumura ,  Shuichi Yasuda ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Kazuhito Shigemori

IPC分类号： G03F7/20 ,  B05D3/00

CPC分类号： G03F7/70991 ,  G03F7/70341

摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.

摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块和界面块。 曝光装置被布置成与界面块相邻。 接口块包括干燥处理组，其包括两个干燥处理单元和界面输送机构。 在通过曝光装置对基板进行曝光处理之后，通过界面传送机构将基板输送到干燥处理组中的干燥处理单元，其中对基板进行清洁和干燥处理。