A tip end portion and an outer surface of a capillary (or of a wedge tool) used in, for instance, a wire bonding apparatus and method, being covered by a diamond layer with a heating element attached to the outer surface thereof. The inside of the capillary is formed by alumina ceramics, having a tapered hole. The tip end of the capillary is formed by the diamond layer, and a face portion and an inner chamfer portion are formed at the tip end to make a wire heating portion. Heat is transferred from the heating element to the wire heating portion through a heat supply path formed by the diamond layer, and a bonding surface formed by a wire and a pad is heated.