公开(公告)号：US07975901B2

公开(公告)日：2011-07-12

申请号：US12794911

申请日：2010-06-07

申请人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

发明人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

IPC分类号： B23K31/02 ,  B23K37/00 ,  C23F1/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00

摘要： A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

摘要翻译： 一种接合装置，包括用于维持惰性气体气氛的室; 用于对焊盘和电极执行表面处理的第一等离子体焰炬，第一等离子体焰炬附接在腔室中，以将气体等离子体施加到衬底和放置在腔室内的半导体芯片; 第二等离子体焰炬，用于对位于所述腔室内的毛细管的前端处的初始球和/或线进行表面处理，所述第二等离子体焰炬附接在所述腔室中，以将气体等离子体施加到所述初始球体;以及 /或电线; 以及用于将表面处理的初始球和/或线结合到腔室中的表面处理的垫和电极的接合单元，从而可以有效地执行电极和垫的表面以及线的清洁。

公开(公告)号：US20100294435A1

公开(公告)日：2010-11-25

申请号：US12794911

申请日：2010-06-07

申请人： Toru MAEDA ,  Tetsuya UTANO ,  Akinobu TERAMOTO

发明人： Toru MAEDA ,  Tetsuya UTANO ,  Akinobu TERAMOTO

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00

摘要： A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

摘要翻译： 一种接合装置，包括用于维持惰性气体气氛的室; 用于对焊盘和电极执行表面处理的第一等离子体焰炬，第一等离子体焰炬附接在腔室中，以将气体等离子体施加到衬底和放置在腔室内的半导体芯片; 第二等离子体焰炬，用于对位于所述腔室内的毛细管的前端处的初始球和/或线进行表面处理，所述第二等离子体焰炬附接在所述腔室中，以将气体等离子体施加到所述初始球体;以及 /或电线; 以及用于将表面处理的初始球和/或线结合到腔室中的表面处理的垫和电极的接合单元，从而可以有效地执行电极和垫的表面以及线的清洁。

公开(公告)号：US20080093416A1

公开(公告)日：2008-04-24

申请号：US11818754

申请日：2007-06-15

申请人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

发明人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

IPC分类号： B23K1/06 ,  B23K1/00 ,  B23K3/00

CPC分类号： B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78252 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A tip end portion and an outer surface of a capillary (or of a wedge tool) used in, for instance, a wire bonding apparatus and method, being covered by a diamond layer with a heating element attached to the outer surface thereof. The inside of the capillary is formed by alumina ceramics, having a tapered hole. The tip end of the capillary is formed by the diamond layer, and a face portion and an inner chamfer portion are formed at the tip end to make a wire heating portion. Heat is transferred from the heating element to the wire heating portion through a heat supply path formed by the diamond layer, and a bonding surface formed by a wire and a pad is heated.

摘要翻译： 在例如引线接合装置和方法中使用的毛细管（或楔形工具）的前端部分和外表面被金刚石层覆盖，加热元件附接到其外表面。 毛细管内部由具有锥形孔的氧化铝陶瓷形成。 毛细管的前端由金刚石层形成，并且在前端形成面部和内倒角部，以形成线加热部。 通过由金刚石层形成的供热路径将加热元件从加热元件传递到线加热部分，并且加热由金属丝和焊盘形成的接合表面。

公开(公告)号：US08716939B2

公开(公告)日：2014-05-06

申请号：US13490654

申请日：2012-06-07

申请人： Tetsuya Utano ,  Toru Maeda ,  Jun'ichi Takahira ,  Masanori Hamajima

发明人： Tetsuya Utano ,  Toru Maeda ,  Jun'ichi Takahira ,  Masanori Hamajima

IPC分类号： H01J7/24

CPC分类号： H05H1/46 ,  H01J37/32009 ,  H01J37/3299

摘要： Provided is a plasma ignition technique allowing easy and reliable ignition and reignition of plasma without monitoring or manual handling. A plasma ignition system according to this technique is provided with a radio-frequency power supply configured to supply a predetermined high frequency signal to an applied electrode for generating plasma; a matching device configured to match impedance on a side of the radio-frequency power supply and impedance on a side of the applied electrode; a forward wave/reflected wave detector configured to detect a forward wave and a reflected wave of the high frequency signal; a high-voltage generator configured to generate a predetermined high voltage; and a controller configured to superimpose the high voltage on the high frequency signal when a ratio of the reflected wave to the forward wave is greater than a first threshold value.

摘要翻译： 提供了等离子体点火技术，允许在不进行监视或手动处理的情况下容易且可靠地点燃和重新点燃等离子体。 根据该技术的等离子体点火系统设置有：高频电源，被配置为向施加的电极提供预定的高频信号以产生等离子体; 匹配装置，被配置为匹配所述射频电源侧的阻抗和所施加的电极的一侧的阻抗; 正射波/反射波检测器，被配置为检测高频信号的正向波和反射波; 配置为产生预定高电压的高压发生器; 以及控制器，被配置为当所述反射波与所述正向波的比率大于第一阈值时，将所述高电压叠加在所述高频信号上。

公开(公告)号：US20120280618A1

公开(公告)日：2012-11-08

申请号：US13490654

申请日：2012-06-07

申请人： Tetsuya Utano ,  Toru Maeda ,  Jun'ichi Takahira ,  Masanori Hamajima

发明人： Tetsuya Utano ,  Toru Maeda ,  Jun'ichi Takahira ,  Masanori Hamajima

IPC分类号： H05H1/46

CPC分类号： H05H1/46 ,  H01J37/32009 ,  H01J37/3299

摘要： Provided is a plasma ignition technique allowing easy and reliable ignition and reignition of plasma without monitoring or manual handling. A plasma ignition system according to this technique is provided with a radio-frequency power supply configured to supply a predetermined high frequency signal to an applied electrode for generating plasma; a matching device configured to match impedance on a side of the radio-frequency power supply and impedance on a side of the applied electrode; a forward wave/reflected wave detector configured to detect a forward wave and a reflected wave of the high frequency signal; a high-voltage generator configured to generate a predetermined high voltage; and a controller configured to superimpose the high voltage on the high frequency signal when a ratio of the reflected wave to the forward wave is greater than a first threshold value.

摘要翻译： 提供了等离子体点火技术，允许在不进行监视或手动处理的情况下容易且可靠地点燃和重新点燃等离子体。 根据该技术的等离子体点火系统设置有：高频电源，被配置为向施加的电极提供预定的高频信号以产生等离子体; 匹配装置，被配置为匹配所述射频电源侧的阻抗和所施加的电极的一侧的阻抗; 正射波/反射波检测器，被配置为检测高频信号的正向波和反射波; 配置为产生预定高电压的高压发生器; 以及控制器，被配置为当所述反射波与所述正向波的比率大于第一阈值时，将所述高电压叠加在所述高频信号上。