- 专利标题： Embedded thermal-electric cooling modules for surface spreading of heat
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申请号： US11591851申请日： 2006-11-01
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公开(公告)号： US20080101038A1公开(公告)日： 2008-05-01
- 发明人: Ihab A. Ali
- 申请人： Ihab A. Ali
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.