公开(公告)号：US07911780B2

公开(公告)日：2011-03-22

申请号：US12241009

申请日：2008-09-29

申请人： Ihab A. Ali ,  Bernard K. Rihn

发明人： Ihab A. Ali ,  Bernard K. Rihn

IPC分类号： G06F1/16

CPC分类号： G06F1/203

摘要： An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

摘要翻译： 电子设备可以设置有容纳在壳体内的用户界面部件和冷却部件。 壳体可以包括具有穿过其形成的开口的至少一个表面，并且使用者界面可以包括通过其形成的一个端口。 用户接口端口可以提供在壳体开口和冷却部件之间的通道的至少第一部分。 通道可允许在冷却部件和壳体开口之间更换流体以冷却电子设备。

公开(公告)号：US20100053883A1

公开(公告)日：2010-03-04

申请号：US12241009

申请日：2008-09-29

申请人： Ihab A. Ali ,  Bemard K. Rihn

发明人： Ihab A. Ali ,  Bemard K. Rihn

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： An electronic device can be provided with a user interface component and a cooling component contained within a housing. The housing may include at least one surface having an opening formed therethrough, and the user interface may include one port formed therethrough. The user interface port may provide at least a first portion of a passageway between the housing opening and the cooling component. The passageway may allow fluids to be exchanged between the cooling component and the housing opening for cooling the electronic device.

摘要翻译： 电子设备可以设置有容纳在壳体内的用户界面部件和冷却部件。 壳体可以包括具有穿过其形成的开口的至少一个表面，并且使用者界面可以包括通过其形成的一个端口。 用户接口端口可以提供在壳体开口和冷却部件之间的通道的至少第一部分。 通道可允许在冷却部件和壳体开口之间更换流体以冷却电子设备。

公开(公告)号：US20100051243A1

公开(公告)日：2010-03-04

申请号：US12241010

申请日：2008-09-29

申请人： Ihab A. Ali ,  Frank Liang

发明人： Ihab A. Ali ,  Frank Liang

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F1/1613 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

摘要翻译： 电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。 流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。 电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

公开(公告)号：US07397164B1

公开(公告)日：2008-07-08

申请号：US10912788

申请日：2004-08-06

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H01L41/04

CPC分类号： F04D33/00 ,  G06F1/203

摘要： A cooling device of an electronic component. The cooling device comprises a carrier having one or more openings, a piezoelectric member moveably disposed in one of the openings, a plurality of conductive wires disposed within the carrier and extending into the openings, wherein one or more conductive wires being coupled to the piezoelectric member, and an interconnecting member connecting the conductive wires to a power source, wherein when power is supplied, the piezoelectric member vibrates to circulate air and dissipate heat.

摘要翻译： 电子部件的冷却装置。 冷却装置包括具有一个或多个开口的载体，可移动地设置在其中一个开口中的压电元件，设置在载体内并延伸到开口中的多个导线，其中一个或多个导线连接到压电元件 以及将导线连接到电源的互连构件，其中当供电时，压电构件振动以使空气循环并散发热量。

公开(公告)号：US06353538B1

公开(公告)日：2002-03-05

申请号：US09311783

申请日：1999-05-13

申请人： Ihab A. Ali ,  Shawn S. McEuen

发明人： Ihab A. Ali ,  Shawn S. McEuen

IPC分类号： H05K700

CPC分类号： H01L23/3675 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generating varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging cover consists of a plastic material having a sheet of metal coupled to an interior surface of the packaging cover. In one embodiment, the packaging cover includes two separate covers, with a first cover having an insert pin, and a second cover having an insert receptacle to receive the insert pin. In an alternative embodiment, the first cover of the packaging cover includes a set of clip snaps to secure a coupling between the first cover and a second cover of the packaging cover.

摘要翻译： 一种存储器模块，其具有封装封装封装封装的板，该板具有多个单独的芯片，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装盖由具有耦合到包装盖的内表面的金属片的塑料材料组成。 在一个实施例中，包装盖包括两个单独的盖，第一盖具有插入销，第二盖具有用于接收插入销的插入件插座。 在替代实施例中，包装盖的第一盖包括一组夹扣，以固定第一盖和包装盖的第二盖之间的联接。

公开(公告)号：US07978474B2

公开(公告)日：2011-07-12

申请号：US11805501

申请日：2007-05-22

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.

摘要翻译： 描述计算机系统的实施例。 该计算机系统包括耦合到热管的电源，其中电源包括集成电路。 该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。 耦合到热管的泵被配置为使液体冷却剂循环通过热管。 此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

公开(公告)号：US07480145B2

公开(公告)日：2009-01-20

申请号：US11591926

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  H05K7/20481 ,  H05K7/20518

摘要： A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

摘要翻译： 系统包括电源和封闭电源的隔热机构。 该热屏蔽机构包括限定电源所在的空腔的三维壳体，以及定位成覆盖由壳体的边缘限定的空腔的开口的板。 注意，壳体包含三层，其中第二层夹在第一层和第三层之间。 该第二层具有第一各向异性热导率。 此外，该板包括具有第二各向异性热导率的材料。

公开(公告)号：US07447033B2

公开(公告)日：2008-11-04

申请号：US11591851

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.

摘要翻译： 便携式计算设备包括具有外表面和内表面的外壳。 计算装置中的固态冷却机构联接到内表面。 该固态冷却机构被配置为保持外表面的至少一部分上的温度差小于预定值。

公开(公告)号：US20080128119A1

公开(公告)日：2008-06-05

申请号：US11607571

申请日：2006-11-30

申请人： Ihab A. Ali ,  Jay S. Nigen

发明人： Ihab A. Ali ,  Jay S. Nigen

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver and is configured to pump heat from inside an enclosed area to outside of the enclosed area. Furthermore, the first fluid-flow port is configured to accommodate a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port, which may be either or both of the fluid-flow ports, is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.

摘要翻译： 冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。 第一热交换器包括强制流体驱动器，并且构造成将热量从封闭区域内部泵送到封闭区域的外部。 此外，第一流体流动端口构造成容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。 注意，第一流体流动端口和第二流体流动端口近似共面。 此外，可以是流体流动端口中的一个或两个的给定流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处更接近的相关联的横截面面积 封闭区域的外侧比在靠近封闭区域内部的给定流体流动端口的边缘处。

公开(公告)号：US20080101038A1

公开(公告)日：2008-05-01

申请号：US11591851

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.