发明申请
- 专利标题: PLASMA APPARATUS AND PLASMA PROCESSING METHOD
- 专利标题(中): 等离子体装置和等离子体处理方法
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申请号: US11933658申请日: 2007-11-01
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公开(公告)号: US20080102222A1公开(公告)日: 2008-05-01
- 发明人: Jun Fujinawa , Norihiro Kadota
- 申请人: Jun Fujinawa , Norihiro Kadota
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 优先权: JP2006-297599 20061101
- 主分类号: C23C16/50
- IPC分类号: C23C16/50 ; H05H1/24
摘要:
The plasma apparatus includes a conveying unit for conveying a substrate in a conveying direction while being situated at a processing position, an elongated electric field forming unit for forming an induction electric field by a coil, opposed to the processing position, a power supply for supplying high frequency power to the coil, an elongated gas introducing unit and a separating unit for separating a region where the forming unit is arranged and a region where the introducing unit is arranged from each other in an airtight fashion, having an elongated dielectric window arranged between the processing position and the forming unit. The forming unit, the introducing unit and the dielectric window are arranged in such a way that there longitudinal directions are matched with a width direction of the substrate being conveyed, and orthogonal to the conveying direction.
公开/授权文献
- US08092600B2 Plasma apparatus and plasma processing method 公开/授权日:2012-01-10