Invention Application
- Patent Title: Patterned thin-film layer and method for manufacturing same
- Patent Title (中): 图案化薄膜层及其制造方法
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Application No.: US11309934Application Date: 2006-10-31
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Publication No.: US20080102253A1Publication Date: 2008-05-01
- Inventor: Ching-Yu Chou , Wen-Tsing Chen
- Applicant: Ching-Yu Chou , Wen-Tsing Chen
- Applicant Address: US CA Santa Clara
- Assignee: ICF Technology Limited.
- Current Assignee: ICF Technology Limited.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G03G7/00
- IPC: G03G7/00

Abstract:
A patterned thin-film layer (100) includes a substrate (102), a plurality of banks (104) formed on the substrate and a plurality of thin-film layers (106). The plurality of banks define a plurality of spaces therein, and the spaces are arranged in rows and columns. The plurality of patterned thin-film layers formed in the plurality of spaces in a manner such that the patterned thin-film layers made of a same material in each row have an irregular thickness distribution. A method for manufacturing a patterned thin-film layer is also provided.
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