发明申请
US20080102640A1 ETCHING OXIDE WITH HIGH SELECTIVITY TO TITANIUM NITRIDE 审中-公开
氧化氮对硝酸钛的选择性高

ETCHING OXIDE WITH HIGH SELECTIVITY TO TITANIUM NITRIDE
摘要:
A substrate comprising an oxide layer covering a nitride layer, is etched in a process zone of a substrate processing chamber. A process gas comprising H2 gas is introduced into the process zone, and the process gas is energized to etch through the oxide layer to at least partially expose the nitride layer. The energized process gas has a selectivity of etching the oxide layer to the nitride layer of at least about 25:1.
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