发明申请
- 专利标题： Metal capped seed layers for the fabrication of wrap around and trailing shields
- 专利标题（中）： 金属盖种子层用于制造包裹和后盾
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申请号： US11595764申请日： 2006-11-10
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公开(公告)号： US20080110761A1公开(公告)日： 2008-05-15
- 发明人: Hieu Lam , Patrick Rush Webb , Yi Zheng
- 申请人： Hieu Lam , Patrick Rush Webb , Yi Zheng
- 主分类号： C25D3/56
- IPC分类号： C25D3/56
摘要：
Methods and structures for the fabrication of wrap around and trailing shield structures are disclosed. Capped seed layers having a dual layer structure are utilized, improving photo resist adhesion and plated shield adhesion, without the need to deposit, then remove, traditional inorganic anti-reflection coatings prior to shield plating.
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