In a method of molding a substrate, a molding structure including a release film and flat plate-shaped epoxy molding compound (EMC) is placed on an upper face of a lower die. The substrate is held by a lower face of an upper die facing the lower die. The molding structure and the substrate are compressed using the lower die and the upper die to form a preliminarily molded substrate. The lower die is then downwardly moved from the upper die to form a molded substrate.