发明申请
US20080113590A1 Polishing method for semiconductor wafer and polishing apparatus for semiconductor wafer
审中-公开
半导体晶片抛光方法及半导体晶片抛光装置
- 专利标题： Polishing method for semiconductor wafer and polishing apparatus for semiconductor wafer
- 专利标题（中）： 半导体晶片抛光方法及半导体晶片抛光装置
-
申请号： US11984057申请日： 2007-11-13
-
公开(公告)号： US20080113590A1公开(公告)日： 2008-05-15
- 发明人: Takeo Kubota , Atsushi Shigeta , Dai Fukushima
- 申请人： Takeo Kubota , Atsushi Shigeta , Dai Fukushima
- 优先权： JP2006-308250 20061114
- 主分类号： B24B7/04
- IPC分类号： B24B7/04 ; B24B41/06
摘要：
A polishing method for a semiconductor wafer having a polishing target surface at a periphery portion thereof is disclosed. The method includes pressing a polishing member against the polishing target surface along a circumference of the semiconductor wafer by a plurality of pressing portions while rotating the semiconductor wafer in a circumferential direction, thereby polishing the polishing target surface of the semiconductor wafer.