发明申请
- 专利标题: Metal Double-Layer Structure and Method For Manufacturing the Same and Regeneration Method of Sputtering Target Employing That Method
- 专利标题(中): 金属双层结构及其制造方法及使用该方法的溅射靶的再生方法
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申请号: US11884878申请日: 2006-02-28
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公开(公告)号: US20080135405A1公开(公告)日: 2008-06-12
- 发明人: Hisashi Hori , Nobushiro Seo , Tomohiro Komoto , Kazuo Tsuchiya
- 申请人: Hisashi Hori , Nobushiro Seo , Tomohiro Komoto , Kazuo Tsuchiya
- 申请人地址: JP Tokyo
- 专利权人: NIPPON LIGHT METAL COMPAYN, LTD.
- 当前专利权人: NIPPON LIGHT METAL COMPAYN, LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2005-061621 20050304
- 国际申请: PCT/JP2006/003704 WO 20060228
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; B23K20/12 ; B32B15/01
摘要:
Provided is a metal double-layer structure in which a modified metallic member modified from a flat plate metallic member is bonded to be stuck to a plate material, manufacturing method thereof, and a method of regenerating a sputtering target using the method. The method includes the steps of: overlapping the plate material with the metallic member; inserting a rotary tool having a rotor and a probe projecting from a bottom surface of the rotor into a surface of the metallic member while rotated; bringing a distal end of the probe to a position close to a mating plane between the metallic member and the plate material to generate friction heat and stir the distal end, and moving the rotary tool to form adjacent motion tracks on the surface of the metallic member; and forming stirred areas along the mating plane to bond the metallic member and the plate material together, and modifying the metallic member into a modified metallic member.
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