发明申请
US20080135532A1 Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate
审中-公开
在脆性基材中形成垂直裂纹的方法和装置
- 专利标题: Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate
- 专利标题(中): 在脆性基材中形成垂直裂纹的方法和装置
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申请号: US11587957申请日: 2005-04-27
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公开(公告)号: US20080135532A1公开(公告)日: 2008-06-12
- 发明人: Noboru Hasaka , Toru Kumagai , Koji Yamamoto
- 申请人: Noboru Hasaka , Toru Kumagai , Koji Yamamoto
- 申请人地址: JP Osaka
- 专利权人: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2004-162570 20040427
- 国际申请: PCT/JP05/07993 WO 20050427
- 主分类号: B23K26/14
- IPC分类号: B23K26/14 ; B23K26/02
摘要:
The forming of a heated spot (10) by using a laser beam irradiated to a brittle substrate along a predetermined scribing line (S) and the ejecting of a cooling medium, after interruption of irradiation of laser beam, to impinge on the spot to thereby form a cooled spot (20) constitute a unit operation to be repeated. The cooled spot overlapping the heated spot (10) that has a longitudinal center line (b) crossing the scribing line (S) at a right angle serves to restore thermal equilibrium in and around the spots while forming unit cracks (n) continued one from another to form a linear crack (E,U) perpendicular to the brittle substrate surface.
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