发明申请
- 专利标题： Semiconductor component including a semiconductor chip and a passive component
- 专利标题（中）： 半导体元件包括半导体芯片和无源元件
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申请号： US11614579申请日： 2006-12-21
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公开(公告)号： US20080135977A1公开(公告)日： 2008-06-12
- 发明人: Thorsten Meyer , Bernd Waidhas , Markus Brunnbauer , Grit Sommer , Thomas Wagner
- 申请人： Thorsten Meyer , Bernd Waidhas , Markus Brunnbauer , Grit Sommer , Thomas Wagner
- 申请人地址： DE Munich
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Munich
- 优先权： DE102006058068.0 20061207
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L29/00
摘要：
Semiconductor element having a semiconductor chip and a passive component, as well as a method for its productionThe invention relates to a semiconductor component (1) having a semiconductor chip (2), and a passive component (3), with the semiconductor component (1) having a coil (6) as the passive component (3). The semiconductor chip (2) and the passive component (3) are embedded in a plastic encapsulation compound (4) with connection elements to external contacts (31).
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