公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

申请人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

发明人： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC分类号： G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC分类号： G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

摘要： A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US09819327B2

公开(公告)日：2017-11-14

申请号：US14398049

申请日：2013-06-26

申请人： Saravana Maruthamuthu ,  Thorsten Meyer ,  Pablo Herrero ,  Andreas Wolter ,  Georg Seidemann ,  Mikael Knudsen ,  Pauli Jaervinen

发明人： Saravana Maruthamuthu ,  Thorsten Meyer ,  Pablo Herrero ,  Andreas Wolter ,  Georg Seidemann ,  Mikael Knudsen ,  Pauli Jaervinen

IPC分类号： H03H7/40 ,  H03H9/00 ,  H04B1/04 ,  H01Q5/335

CPC分类号： H03H9/0014 ,  H01Q5/335 ,  H03H7/40 ,  H04B1/0458

摘要： Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.

公开(公告)号：US09219034B2

公开(公告)日：2015-12-22

申请号：US13448583

申请日：2012-04-17

申请人： Thorsten Meyer ,  Grit Sommer

发明人： Thorsten Meyer ,  Grit Sommer

IPC分类号： H01L21/4763 ,  H01L23/525 ,  H01L23/522 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/525 ,  H01L23/3114 ,  H01L23/522 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L24/12 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/12105 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00

摘要： A module includes a semiconductor chip and a conductive layer arranged over the semiconductor chip. The module also includes a spacer structure arranged to deflect the conductive layer away from the semiconductor chip.

摘要翻译： 模块包括半导体芯片和布置在半导体芯片上的导电层。 该模块还包括间隔结构，其布置成使导电层偏离半导体芯片。

公开(公告)号：US20150282367A1

公开(公告)日：2015-10-01

申请号：US14227977

申请日：2014-03-27

申请人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

发明人： Hans-Joachim Barth ,  Reinhard Mahnkopf ,  Sven Albers ,  Thorsten Meyer

IPC分类号： H05K7/02 ,  H05K13/00 ,  H05K3/36

CPC分类号： H05K7/02 ,  H01L23/3128 ,  H01L24/19 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2924/15311 ,  H05K3/36 ,  H05K7/023 ,  H05K13/00 ,  H05K2203/06 ,  Y10T156/10

摘要： An electronic assembly that includes a first electronic component that includes a first substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the first substrate, a second electronic component that includes a second substrate having a front side and a back side and at least one electronic assembly mounted on the front side of the second substrate, and wherein the back side of the first substrate is directly attached to the back side of the second substrate.

摘要翻译： 一种电子组件，其包括第一电子部件，所述第一电子部件包括具有前侧和后侧的第一基板和安装在所述第一基板的前侧上的至少一个电子组件，所述第二电子部件包括具有前部的第二基板 侧面和背面以及安装在第二基板的前侧上的至少一个电子组件，并且其中第一基板的背面直接附接到第二基板的背面。

公开(公告)号：US20150187608A1

公开(公告)日：2015-07-02

申请号：US14141343

申请日：2013-12-26

申请人： Sanka GANESAN ,  Thorsten MEYER ,  Robert L. SANKMAN ,  Mark T. BOHR ,  Frank ZUDOCK

发明人： Sanka GANESAN ,  Thorsten MEYER ,  Robert L. SANKMAN ,  Mark T. BOHR ,  Frank ZUDOCK

IPC分类号： H01L21/56 ,  H01L23/00

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/24137 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/92224 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

摘要： A die package architecture with an embedded die and simplified redistribution layer is described. In one example a method includes attaching a front side of a die to a temporary carrier panel applying a molding compound around the die and over the temporary carrier panel. Removing the temporary carrier, applying a metal routing layer over the front side of the die and the molding compound, and applying a connection array to the metal routing layer.

摘要翻译： 描述了具有嵌入式管芯和简化再分配层的管芯封装体系结构。 在一个示例中，一种方法包括将模具的前侧附接到临时载体板上，所述临时载体板在模具周围施加模塑料并在临时载体板上。 移除临时载体，在模具的前侧和模塑料上施加金属布线层，并将连接阵列施加到金属布线层。

公开(公告)号：US20140361387A1

公开(公告)日：2014-12-11

申请号：US13910133

申请日：2013-06-05

申请人： Thorsten Meyer ,  Gerald Ofner ,  Christian Mueller ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

发明人： Thorsten Meyer ,  Gerald Ofner ,  Christian Mueller ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0077 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound.

摘要翻译： 芯片布置可以包括：模具化合物; 以及至少部分地嵌入模具化合物中的微机电系统装置。

公开(公告)号：US20140197530A1

公开(公告)日：2014-07-17

申请号：US13739045

申请日：2013-01-11

申请人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

发明人： Thorsten Meyer ,  Sven Albers ,  Christian Geissler ,  Andreas Wolter ,  Markus Brunnbauer ,  David O'Sullivan ,  Frank Zudock ,  Jan Proschwitz

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L23/315 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device is described having at least one semiconductor chip, the chip having an active area on a top side thereof, the active area formed at least in part of low-k material, said low-k material defining a low-k subarea of said active area; an embedding material, in which said at least one semiconductor chip is embedded, at least part of the embedding material forming a coplanar area with said active area; at least one contact area within the low-k subarea; a redistribution layer on the coplanar area, the redistribution layer connected to said contact areas; at least one first-level interconnect, located outside said low-k subarea, the first-level interconnect electrically connected to at least one of said contact areas via the redistribution layer.

摘要翻译： 描述了半导体器件，其具有至少一个半导体芯片，该芯片在其顶侧具有有源区，至少部分形成在低k材料上的有源区，所述低k材料限定低k分区 说活跃区; 嵌入材料，其中所述至少一个半导体芯片被嵌入，所述嵌入材料的至少一部分与所述有源区域形成共面区域; 低k子区域内的至少一个接触区域; 在共面区域上的再分配层，再分配层连接到所述接触区域; 位于所述低k子区域外的至少一个第一级互连，所述第一级互连经由再分配层电连接到所述接触区域中的至少一个。

公开(公告)号：US08754522B2

公开(公告)日：2014-06-17

申请号：US13281795

申请日：2011-10-26

申请人： Thorsten Meyer ,  Gerald Ofner

发明人： Thorsten Meyer ,  Gerald Ofner

IPC分类号： H01L23/34

CPC分类号： H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer.

摘要翻译： 可修复的半导体器件和方法。 在一个实施例中，一种方法提供了具有第一半导体芯片和第一金属层的第一主体。 第二主体包括第二半导体芯片和第二金属层。 第一金属层的金属被去除。 第一半导体芯片从第一主体移除。 第二个身体连接到第一个身体。 第一金属层电耦合到第二金属层。

公开(公告)号：US08716859B2

公开(公告)日：2014-05-06

申请号：US13346993

申请日：2012-01-10

申请人： Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

发明人： Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

IPC分类号： H01L23/52

CPC分类号： H01L24/81 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： A flip chip package structure is proposed in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.

摘要翻译： 提出了一种倒装芯片封装结构，其中再分配层（RDL）设置在半导体芯片和半导体芯片表面的一个或多个侧向延伸部分的表面上。 横向延伸部可以使用例如重构的晶片来实现半导体芯片的一个或多个侧面的横向扇出区域。 可以将一个或多个电连接器（例如焊料凸块或铜圆筒）施加到RDL，并且诸如PCB插入器的插入件可以连接到电连接器。 以这种方式，可以容纳相对紧凑的半导体衬垫间距并将其转换成适当的电路板间距，而不需要硅或玻璃插入件。

公开(公告)号：US20140094512A1

公开(公告)日：2014-04-03

申请号：US14037966

申请日：2013-09-26

申请人： Nikolas Gunkel ,  Thorsten Meyer ,  John Michael Graettinger

发明人： Nikolas Gunkel ,  Thorsten Meyer ,  John Michael Graettinger

IPC分类号： A23K1/16 ,  A23K1/18 ,  C07D311/04

CPC分类号： C07D311/04 ,  A23K20/111 ,  A23K20/121 ,  A23K20/132 ,  A23K20/137 ,  A23K50/10 ,  C07D311/58

摘要： The present invention relates to compositions and methods for modulating the degree of adipose tissue deposited intramuscularly in cattle by administration of a retinoic receptor antagonist or inverse agonist and compounds for use in such method.

摘要翻译： 本发明涉及通过施用视黄酸受体拮抗剂或反向激动剂和用于这种方法的化合物来调节牛肌内沉积的脂肪组织的程度的组合物和方法。