发明申请
- 专利标题： METHOD OF MANUFACTURING HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND HYBRID STRUCTURE THEREOF
- 专利标题（中）： 制造多层基板混合结构的方法及其混合结构
-
申请号： US11856867申请日： 2007-09-18
-
公开(公告)号： US20080136021A1公开(公告)日： 2008-06-12
- 发明人: Chih-kuang Yang
- 申请人： Chih-kuang Yang
- 申请人地址： TW Hsinchu
- 专利权人： Princo Corp.
- 当前专利权人： Princo Corp.
- 当前专利权人地址： TW Hsinchu
- 优先权： TW095145488 20061206
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/00
摘要：
Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.
公开/授权文献
信息查询
IPC分类:
