发明申请
- 专利标题： Light emitting diode package and method of manufacturing the same
- 专利标题（中）： 发光二极管封装及其制造方法
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申请号： US11826248申请日： 2007-07-13
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公开(公告)号： US20080142822A1公开(公告)日： 2008-06-19
- 发明人: Hyun Jun Kim , Chang Hwan Choi , Jong Myeon Lee , Dong Woohn Kim , Won Ha Moon
- 申请人： Hyun Jun Kim , Chang Hwan Choi , Jong Myeon Lee , Dong Woohn Kim , Won Ha Moon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2006-0127324 20061213
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.
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