发明申请
- 专利标题: Manufacturing Method For Micro-SD Flash Memory Card
- 专利标题(中): Micro-SD闪存卡的制造方法
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申请号: US11966871申请日: 2007-12-28
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公开(公告)号: US20080145968A1公开(公告)日: 2008-06-19
- 发明人: Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
- 申请人: Siew S. Hiew , Nan Nan , Paul Hsueh , Abraham C. Ma , Ming-Shiang Shen
- 申请人地址: US CA San Jose
- 专利权人: Super Talent Electronics, Inc.
- 当前专利权人: Super Talent Electronics, Inc.
- 当前专利权人地址: US CA San Jose
- 主分类号: H05K3/00
- IPC分类号: H05K3/00 ; H01L21/00
摘要:
A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.
公开/授权文献
- US08141240B2 Manufacturing method for micro-SD flash memory card 公开/授权日:2012-03-27