公开(公告)号：US20080145968A1

公开(公告)日：2008-06-19

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/00 ,  H01L21/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using a used to connect each PCB to a PCB panel are then cut using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用用于将每个PCB连接到PCB面板的连接桥件进行切割，然后使用旋转锯切割。 然后执行前沿倒角处理。

公开(公告)号：US07874067B1

公开(公告)日：2011-01-25

申请号：US12137432

申请日：2008-06-11

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  G06F13/36

CPC分类号： G06F1/1632 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/049 ,  H05K2203/1316 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

摘要翻译： 根据本发明的某些实施例，单芯片COB USB制造在具有多个单独的USB PCB基板的PCB面板上使用芯片上（COB）工艺。 这种单芯片COB USB以N×M矩阵阵列布置。 该方法的优点是：1）使用PCBA成型，与传统的SMT工艺相比，在基板上安装所有必要的部件以形成PCBA; 2）更简单的矩形结构，适合任何外部装饰外壳包装附加值; 和3）如果不防水，包装是防潮的。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US08240034B1

公开(公告)日：2012-08-14

申请号：US12128502

申请日：2008-05-28

申请人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Frank I-Kang Yu ,  David Q. Chow ,  Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  G11C16/10 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/165 ,  H01L25/50 ,  H01L27/11517 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K3/0052 ,  H05K3/0097 ,  H05K5/0278 ,  H05K2201/10159 ,  H05K2203/167 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2924/00012 ,  H01L2924/00

摘要： According to certain embodiments of the invention, a flash memory card is manufactured using COB processes on a PCB panel with multiple micro cards PCB substrates. These micro memory cards are laid out in an array of 3×5 matrixes of micro cards PCB substrates. A method of molding over a PCBA is utilized, contrary to a conventional method of having two or more pieces of package components to tape together. This results in a simpler structure without the notch which enables easier singulation process and the package is moisture resistance. The final product is a single piece versus two or three pieces glued up pieces and would not separate from pieces. The final product has high water and moisture resistance, low cost and fast manufacturing throughput, no seam and aesthetically more appeasing, can stack more layers of flash memory die, and be maximized XY spaces to accommodate larger size flash memory die.

摘要翻译： 根据本发明的某些实施例，使用COB处理在具有多个微卡PCB基板的PCB面板上制造闪存卡。 这些微型存储卡被布置在3×5矩阵的微卡PCB基板的阵列中。 利用PCBA上的成型方法，这与将两个或多个包装部件捆绑在一起的传统方法相反。 这导致更简单的结构，没有凹口，这使得更容易的分离过程和封装是防潮性的。 最终产品是单件，而不是两件或三件胶合，不会与件分离。 最终产品具有高耐水和耐湿性，低成本和快速的制造生产能力，无缝和美观上的安抚，可以堆叠多层闪存芯片，并最大化XY空间以适应更大尺寸的闪存芯片。

公开(公告)号：US20080235939A1

公开(公告)日：2008-10-02

申请号：US12033851

申请日：2008-02-19

申请人： Siew S. Hiew ,  Charles C. Lee ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Charles C. Lee ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/20 ,  G11C11/34

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/10159 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85 ,  H01L2924/00

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCB regions arranged in parallel rows. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded layer is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The panel is then singulated using one of a laser cutting method, an abrasive water jet cutting method, and a mechanical grinding method such that the resulting PCB substrate and plastic housing have the width, height and length specified by MicroSD specifications. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有平行排布置的多个PCB区域的PCB面板。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制层。 然后使用激光切割方法，磨料水射流切割方法和机械研磨方法之一将面板切片，使得所得PCB基板和塑料外壳具有由MicroSD规格规定的宽度，高度和长度。 然后执行前沿倒角处理。

公开(公告)号：US20080195817A1

公开(公告)日：2008-08-14

申请号：US12106517

申请日：2008-04-21

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  I-Kang Yu ,  Abraham C. Ma

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  I-Kang Yu ,  Abraham C. Ma

IPC分类号： G06F13/00 ,  H05K3/20

CPC分类号： H05K3/284 ,  G06K19/077 ,  G06K19/07732 ,  H01L23/49855 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/023 ,  H05K1/117 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/10159 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y10T29/49128 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.

摘要翻译： 包括PCBA的存储卡（例如，SD或MMC）装置，其中部件安装在包括至少一个刚性PCB部分和至少一个柔性PCB部分的“刚性柔性”PCB上，以及壳体， 模制的上壳体部分和模制壳体。 刚性柔性PCB被安装到上部壳体部分中，使得设置在刚性 - 柔性PCB的上表面上的标准金属触点通过限定上部壳体部分的开口暴露，并且使得柔性柔性PCB的柔性部分 超过形成在上壳体部分的内表面上的任何轮廓。 然后通过在刚性柔性PCB的下表面上沉积热固性塑料形成模制套管。

公开(公告)号：US07466556B2

公开(公告)日：2008-12-16

申请号：US11874176

申请日：2007-10-17

申请人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K7/14

CPC分类号： H01L21/565 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/117 ,  H05K3/284 ,  H05K5/0278 ,  Y10T29/49124 ,  H01L2224/85 ,  H01L2924/00014

摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.

摘要翻译： 一个低调的通用串行总线（USB）组件包括安装在旋转外壳中的模块化USB内核组件。 模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 旋转壳​​体包括通过枢轴销可枢转地安装到外壳中的保持器。 枢轴销是分离的结构，其插入形成在保持器和壳体中的孔中，或者一体地形成在保持器上。

公开(公告)号：US07535719B2

公开(公告)日：2009-05-19

申请号：US11874174

申请日：2007-10-17

申请人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Jin Kyu Kim ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K1/14

CPC分类号： H05K5/0278 ,  H01L21/565 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/117 ,  H05K3/284 ,  H01L2924/00014 ,  H01L2224/85

摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.

摘要翻译： 一个低调的通用串行总线（USB）组件包括可缩回地安装到外部外壳中的模块化USB内核组件。 模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 壳体包括可伸缩机构，其可以通过将模块化USB芯部件的前部部分滑入和移出壳体的前开口来促进金属触点的选择性暴露，或者通过提供可滑动地覆盖壳体的前部的盖板 模块化的USB核心组件。

公开(公告)号：US07447037B2

公开(公告)日：2008-11-04

申请号：US11859685

申请日：2007-09-21

申请人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Jim Chin-Nan Ni ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K1/14

CPC分类号： H05K3/284 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01R13/665 ,  H05K1/117 ,  H05K5/0278 ,  H01L2224/85

摘要： A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.

摘要翻译： 一个低调的通用串行总线（USB）组件包括一个模块化的USB内核组件和一个外壳。 模块化USB核心组件包括一个PCBA，其中所有无源组件和未封装的IC芯片都连接到与金属触点相对的PCB的单侧。 IC芯片（例如，USB控制器，闪速存储器）通过引线接合或其它板上芯片（COB）技术附接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。 然后将模块化的USB核心组件插入或以外部塑料外壳组合以提供USB组件。 公开了一种可选的手提箱。

公开(公告)号：US08102658B2

公开(公告)日：2012-01-24

申请号：US12649233

申请日：2009-12-29

申请人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

发明人： Siew S. Hiew ,  Abraham C. Ma ,  Nan Nan

IPC分类号： H05K7/02

CPC分类号： G06F1/1632 ,  H05K1/117 ,  H05K3/202 ,  H05K3/4092 ,  H05K5/0282 ,  Y10S439/945 ,  Y10S439/946 ,  Y10T29/49126

摘要： A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.

摘要翻译： microSD-SD适配器卡包括具有引线框架结构的基底基板，形成包围引线框架结构的八个microSD接触销的腔室的保护盖，以及形成在保护帽和暴露部分上的热固性塑料外壳 基板为适配卡提供标准的SD卡尺寸。 后开口便于插入标准microSD卡，由此microSD卡上的八个接触垫与室内的八个microSD接触针接触，以使由microSD卡产生的电信号通过以下方式传输到主机系统： 标准SD插座。 夹紧销钉设置在腔室内以与设置在microSD卡上的把手接合部接合。 在模制塑料外壳上设有一个预先模制的开关槽，并在模制后安装插入式写保护开关。