发明申请
US20080148879A1 Seek-scan probe (SSP) including see-saw scan probe with redundant tip
有权
包括扫描探头（SSP），包括具有冗余尖端的锯齿扫描探针
- 专利标题： Seek-scan probe (SSP) including see-saw scan probe with redundant tip
- 专利标题（中）： 包括扫描探头（SSP），包括具有冗余尖端的锯齿扫描探针
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申请号： US11644650申请日： 2006-12-21
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公开(公告)号： US20080148879A1公开(公告)日： 2008-06-26
- 发明人: Tsung-Kuan Allen Chou
- 申请人： Tsung-Kuan Allen Chou
- 主分类号： G01D21/00
- IPC分类号： G01D21/00
摘要：
An apparatus comprising a substrate having a probe suspension formed thereon, a see-saw probe coupled to the probe suspension, the see-saw probe including first and second ends, with a tip projecting from a side of the first end, and an actuation electrode formed on the substrate, the actuation electrode positioned to exert a force upon the second end of the see-saw probe. A process comprising forming a probe suspension on a substrate, coupling a see-saw probe to the probe suspension, the see-saw probe including first and second ends, with a tip projecting from a side of the first end, and forming an actuation electrode on the substrate, the actuation electrode positioned to exert a force upon the second end of the see-saw probe.
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