摘要:
A seek-scan probe (SSP) memory involves multiple-wafer bonding needing precision small gaps in between. Solder reflow bonding is typically used to join the wafers due to its reliability and ability to hermetically seal. However, solder reflow bonding may not provide a consistently controllable gap due to flowing solder during the bonding process. Thus, a bond stop technique and process is used to provide accurate cantilever to media gap control.
摘要:
A suspended IO trace design for SSP cantilever Read/Write is described. Instead of having the whole I/O trace attached to surface of the cantilever, the cantilever is designed with fish-bone-like support and the I/O traces are anchored to cantilever structures 110 at some specific attachment locations with dielectric insulation in between. This design provides very compliant trace compared to cantilever's see-saw actuation around the torsional beam pivot and is also insensitive to residual stress variations from I/O trace in fabrication.
摘要:
An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.
摘要:
Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.
摘要:
Embodiments of the invention describe a contact switch, which may include a bottom electrode structure including a bottom actuation electrode and a top electrode structure including a top actuation electrode and one or more stoppers able to maintain a predetermined gap between the top electrode and the bottom electrode when the switch is in a collapsed state.
摘要:
An electromechanical switch includes an actuation electrode, a cantilever electrode, a contact, a suspended conductor, and a signal line. The actuation electrode is mounted to a substrate, the cantilever electrode is suspended proximate to the actuation electrode, and the contact is mounted to the cantilever electrode. The suspended conductor is coupled to the contact and straddles a portion of the cantilever electrode. The signal line is positioned to form a closed circuit with the contact and the suspended conductor when an actuation voltage is applied between the actuation electrode and the cantilever electrode.
摘要:
In one embodiment, the present invention includes an apparatus having a cantilever structure to move in a vertical direction, including a grounded cantilever body and a conductive tip, a vertical actuation electrode to actuate the cantilever to cause the conductive tip to contact a ferroelectric media surface, an AC electrostatic drive electrode to produce electrostatic forces to cause the cantilever structure to vibrate, and a sensing trace coupled with the conductive tip to sense charge generated by the ferroelectric media surface in response to a force applied by the conductive tip. Other embodiments are described and claimed.
摘要:
In one embodiment, the present invention includes a method for forming a sacrificial oxide layer on a base layer of a microelectromechanical systems (MEMS) probe, patterning the sacrificial oxide layer to provide a first trench pattern having a substantially rectangular form and a second trench pattern having a substantially rectangular portion and a lateral portion extending from the substantially rectangular portion, and depositing a conductive layer on the patterned sacrificial oxide layer to fill the first and second trench patterns to form a support structure for the MEMS probe and a cantilever portion of the MEMS probe. Other embodiments are described and claimed.
摘要:
An electromechanical switch includes an actuation electrode, an anchor, a cantilever electrode, a contact, and signal lines. The actuation electrode and anchor are mounted to a substrate. The cantilever electrode is supported by the anchor above the actuation electrode. The contact is mounted to the cantilever electrode. The signal lines are positioned to form a closed circuit with the contact when an actuation voltage is applied between the actuation electrode and the cantilever electrode causing the cantilever electrode to bend towards the actuation electrode in a zipper like movement starting from a distal end of the cantilever electrode.
摘要:
According to one embodiment a microelectromechanical (MEMS) switch is disclosed. The MEMS switch includes a substrate, a plurality of actuation electrodes mounted on the substrate, a plurality of bottom electrodes mounted on the substrate, a capacitor having subcomponents mounted on the two or more bottom electrodes and a top bendable electrode mounted on the substrate. The top electrode collapses a first magnitude towards the actuation electrodes whenever a first voltage is applied to one or more of the actuation electrodes and collapses a second magnitude towards the actuation electrodes whenever a second voltage is applied to the actuation electrodes.