发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US11964460申请日： 2007-12-26
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公开(公告)号： US20080150108A1公开(公告)日： 2008-06-26
- 发明人: Miho Mochizuki
- 申请人： Miho Mochizuki
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-349772 20061226
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A semiconductor package includes: a semiconductor chip and a plurality of frames. A plurality of electrodes are formed on a surface of the semiconductor chip. The plurality of frames are connected to the plurality of electrodes. The plurality of frames are formed by dividing one conductive plate by etching.
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