发明申请
- 专利标题： Semiconductor Package With Rigid And Flexible Circuits
- 专利标题（中）： 具有刚性和柔性电路的半导体封装
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申请号： US12044828申请日： 2008-03-07
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公开(公告)号： US20080150123A1公开(公告)日： 2008-06-26
- 发明人: Ming Li , Sayeh Khalili , Donald R. Mullen
- 申请人： Ming Li , Sayeh Khalili , Donald R. Mullen
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
The semiconductor package includes a rigid circuit board substrate having a substrate first side and an opposing substrate second side. The package also includes multiple electrical contacts coupled to the substrate at the substrate first side. An adhesive directly contacts the substrate second side. A semiconductor device directly contacts the adhesive. At least one flexible conductor is electrically connected to the semiconductor device and to at least one of the electrical contacts. The flexible conductor extends from the first side to the second side of the substrate.
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