发明申请
- 专利标题： RELEASE LAYER FOR IN-MOLD DECORATION
- 专利标题（中）： 释放层内装饰
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申请号： US12039554申请日： 2008-02-28
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公开(公告)号： US20080152855A1公开(公告)日： 2008-06-26
- 发明人: Fei Wang , Scott C.J. Tseng , Xiaojia Wang , Kai-Chia Feng , Haiyan Gu , HongMei Zang , Rong-Chang Liang
- 申请人： Fei Wang , Scott C.J. Tseng , Xiaojia Wang , Kai-Chia Feng , Haiyan Gu , HongMei Zang , Rong-Chang Liang
- 主分类号： B32B33/00
- IPC分类号： B32B33/00 ; B05D5/10
摘要：
This invention relates to a composition suitable for the formation of a release layer in an in-mold decoration or thermal transfer printing process. The invention also relates to a process for the formation of a release layer comprising dispersing or dissolving the release layer composition of the present invention in a solvent followed by curing said composition.
公开/授权文献
- US07910205B2 Release layer for in-mold decoration 公开/授权日：2011-03-22
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