发明申请
US20080157314A1 STRUCTURE AND METHOD FOR STOCHASTIC INTEGRATED CIRCUIT PERSONALIZATION
失效
STCCHASTIC集成电路个性化的结构与方法
- 专利标题: STRUCTURE AND METHOD FOR STOCHASTIC INTEGRATED CIRCUIT PERSONALIZATION
- 专利标题(中): STCCHASTIC集成电路个性化的结构与方法
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申请号: US11619196申请日: 2007-01-03
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公开(公告)号: US20080157314A1公开(公告)日: 2008-07-03
- 发明人: Lawrence A. Clevenger , Matthew E. Colburn , Timothy J. Dalton , Michael C. Gaidis , Louis L. C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
- 申请人: Lawrence A. Clevenger , Matthew E. Colburn , Timothy J. Dalton , Michael C. Gaidis , Louis L. C. Hsu , Carl Radens , Keith Kwong Hon Wong , Chih-Chao Yang
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/02
- IPC分类号: H01L23/02
摘要:
A method of forming a stochastically based integrated circuit encryption structure includes forming a lower conductive layer over a substrate, forming a short prevention layer over the lower conductive layer, forming an intermediate layer over the short prevention layer, wherein the intermediate layer is characterized by randomly structured nanopore features. An upper conductive layer is formed over the random nanopore structured intermediate layer. The upper conductive layer is patterned into an array of individual cells, wherein a measurable electrical parameter of the individual cells has a random distribution from cell to cell with respect to a reference value of the electrical parameter.
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