发明申请
- 专利标题： PACKAGE ON PACKAGE DESIGN TO IMPROVE FUNCTIONALITY AND EFFICIENCY
- 专利标题（中）： 包装设计提高功能和效率
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申请号： US11648143申请日： 2006-12-29
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公开(公告)号： US20080157350A1公开(公告)日： 2008-07-03
- 发明人: Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
- 申请人： Bok Eng Cheah , Shanggar Periaman , Kooi Chi Ooi
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/00
摘要：
Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.
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