Invention Application
- Patent Title: SOLID ELECTROLYTIC CAPACITOR AND LEAD FRAME THEREOF
- Patent Title (中): 固体电解电容器及其引线框架
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Application No.: US11766802Application Date: 2007-06-22
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Publication No.: US20080158782A1Publication Date: 2008-07-03
- Inventor: Cheng-Liang Cheng , Kuo-Ching Cheng , Yi-Hsiu Pan , Bang-Hao Wu , Li-Duan Tsai
- Applicant: Cheng-Liang Cheng , Kuo-Ching Cheng , Yi-Hsiu Pan , Bang-Hao Wu , Li-Duan Tsai
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW95149992 20061229
- Main IPC: H01G9/15
- IPC: H01G9/15 ; H05K7/18

Abstract:
A solid electrolytic capacitor having multiple capacitor elements and a lead frame is provided. Each capacitor element includes an anode part, a cathode part, an insulating part and at least one first slit. The cathode part is disposed opposite to the anode part. The insulating part is disposed between the anode part and the cathode part. The first slit is disposed at the anode part. The lead frame has an upper surface and a lower surface where the capacitor elements are stacked on. The lead frame includes an anode terminal part electrically connected to the anode part, and includes a cathode terminal part electrically connected to the cathode part. Specially, the anode terminal part includes at least one first projecting part, which projects toward the upper surface. The capacitor elements are stacked on the upper surface and the first slit is inserted into the first projecting part.
Public/Granted literature
- US07447000B2 Solid electrolytic capacitor and lead frame thereof Public/Granted day:2008-11-04
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