A molding composition which comprises the following components: a) a semicrystalline copolyamide and b) an effective amount of a crystallization aid selected from nanoscale fillers and metal salts, metal oxides, or metal hydroxides which can react with the carboxy end groups of the copolyamide, where the copolyamide can be prepared from the following monomer combination: α) from 50 to 99 mol % of a lactam or of a corresponding co-aminocarboxylic acid having 8, 9, 10, 11, or 12 carbon atoms or of a substantially equimolar mixture composed of a diamine and of a dicarboxylic acid, where the diamine has been selected from the group of 1,6-hexamethylenediamine, 1,8-octamethylenediamine, 1,10-decamethylenediamine, and 1,12-dodecamethylenediamine, and the dicarboxylic acid has been selected from the group of sebacic acid and 1,12-dodecanedioic acid, and β) from 1 to 50 mol % of a substantially equimolar mixture composed of a diamine and of a dicarboxylic acid, where either the diamine or the dicarboxylic acid or both differ from the diamine used, if appropriate, under α) and, respectively, the dicarboxylic acid used, if appropriate under α), or of another lactam and, respectively, ω-aminocarboxylic acid, is transparent and has good processability, and gives good results in decoration by means of screen printing.