发明申请
US20080168946A1 Liquid supplying unit and method, facility for treating substrates with the unit, and method for treating substrates
审中-公开
液体供应单元和方法,用于处理基板的设备,以及用于处理基板的方法
- 专利标题: Liquid supplying unit and method, facility for treating substrates with the unit, and method for treating substrates
- 专利标题(中): 液体供应单元和方法,用于处理基板的设备,以及用于处理基板的方法
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申请号: US12006668申请日: 2008-01-04
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公开(公告)号: US20080168946A1公开(公告)日: 2008-07-17
- 发明人: Tae-Young Nam , Tae-Ho Kim , Ho-Wang Kim , Sang-Gon Lee , Byung-Ho Ahn , Hyung-Koo Kim
- 申请人: Tae-Young Nam , Tae-Ho Kim , Ho-Wang Kim , Sang-Gon Lee , Byung-Ho Ahn , Hyung-Koo Kim
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0003838 20070112
- 主分类号: C23C16/54
- IPC分类号: C23C16/54
摘要:
In a liquid supplying unit liquid is supplied from a buffer vessel to an external unit by pressurizing the liquid present in the buffer vessel using gas supplied to the buffer vessel. A pressure measuring member is provided to measure the pressure inside the buffer vessel, and when the pressure inside the buffer vessel is equal to or greater than a preset reference pressure during refilling of the buffer vessel, gas is discharged from the buffer vessel through a vent line.
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