Apparatus and method for cleaning probe card contacts
    1.
    发明申请
    Apparatus and method for cleaning probe card contacts 审中-公开
    用于清洁探针卡触点的装置和方法

    公开(公告)号:US20050034743A1

    公开(公告)日:2005-02-17

    申请号:US10950583

    申请日:2004-09-28

    CPC分类号: B24B19/16 B08B1/00 G01R3/00

    摘要: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

    摘要翻译: 用于从集成电路测试探针装置的测试探针卡的多个电触点清除碎片和残留物的装置和方法优选地包括具有沟槽表面的硅晶片,测试探针卡被移动到加压接触中。 带槽的表面提供了一种光栅结构,当与加压的电触点组合时,会粉碎任何中间或附着的残留物颗粒,然后将其分解成更小的颗粒并从探针卡上脱落。 探针卡的压力和相对运动可以由各种测量传感器控制。

    Apparatus and method for cleaning probe card contacts
    3.
    发明授权
    Apparatus and method for cleaning probe card contacts 失效
    用于清洁探针卡触点的装置和方法

    公开(公告)号:US06813804B2

    公开(公告)日:2004-11-09

    申请号:US10162675

    申请日:2002-06-06

    IPC分类号: B08B500

    CPC分类号: B24B19/16 B08B1/00 G01R3/00

    摘要: An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

    摘要翻译: 用于从集成电路测试探针装置的测试探针卡的多个电触点清除碎片和残留物的装置和方法优选地包括具有沟槽表面的硅晶片,测试探针卡被移动到加压接触中。 带槽的表面提供了一种光栅结构,当与加压的电触点组合时,会粉碎任何中间或附着的残留物颗粒,然后将其分解成更小的颗粒并从探针卡上脱落。 探针卡的压力和相对运动可以由各种测量传感器控制。