- 专利标题: Resist material and nanofabrication method
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申请号: US12077119申请日: 2008-03-17
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公开(公告)号: US20080171290A1公开(公告)日: 2008-07-17
- 发明人: Akira Kouchiyama , Katsuhisa Aratani
- 申请人: Akira Kouchiyama , Katsuhisa Aratani
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 优先权: JPJP2002-046029 20020222; JPJP2002-297893 20021010
- 主分类号: G03F7/04
- IPC分类号: G03F7/04 ; G03F7/26
摘要:
A resist material and a nanofabrication method provide high-resolution nanofabrication without an expensive irradiation apparatus using, for example, electron beams or ion beams. That is, the resist material and the nanofabrication method provide finer processing using exposure apparatuses currently in use. A resist layer of an incompletely oxidized transition metal such as W and Mo is selectively exposed and developed to be patterned in a predetermined form. The incompletely oxidized transition metal herein is a compound having an oxygen content slightly deviated to a lower content from the stoichiometric oxygen content corresponding to a possible valence of the transition metal. In other words, the compound has an oxygen content lower than the stoichiometric oxygen content corresponding to a possible valence of the transition metal.
公开/授权文献
- US07560220B2 Resist material and nanofabrication method 公开/授权日:2009-07-14
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