发明申请
- 专利标题: Process for forming electrodeposition coating film
- 专利标题(中): 电沉积涂膜形成工艺
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申请号: US12007858申请日: 2008-01-16
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公开(公告)号: US20080173216A1公开(公告)日: 2008-07-24
- 发明人: Keisuke Tsutsui , Kenichi Yoshizawa , Koichi Suda , Koji Izumiya
- 申请人: Keisuke Tsutsui , Kenichi Yoshizawa , Koichi Suda , Koji Izumiya
- 优先权: JP2007-8990 20070118
- 主分类号: C25D3/22
- IPC分类号: C25D3/22 ; C09D11/10 ; C09D11/02
摘要:
The present invention is intended to provide a process for forming an electrodeposition coating film, wherein generation of gas pinhole is reduced and coating film appearance is excellent without using a specific resin as a binder resin.The present invention relates a process for forming an electrodeposition coating film having reduction of generation of gas pinhole, comprising a step of electrocoating by immersing an article to be coated in a cationic electrodeposition coating composition, wherein, the cationic electrodeposition coating composition comprises 10 to 30 parts by weight of a pigment comprising zinc oxide based on 100 parts by weight of a solid content of the coating composition, and the content of zinc oxide contained in the pigment is 0.25 to 5 parts by weight based on 100 parts by weight of the pigment.