发明申请
US20080173904A1 CMOS image sensors with a bonding pad and methods of forming the same
审中-公开
具有焊盘的CMOS图像传感器及其形成方法
- 专利标题： CMOS image sensors with a bonding pad and methods of forming the same
- 专利标题（中）： 具有焊盘的CMOS图像传感器及其形成方法
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申请号： US11655856申请日： 2007-01-22
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公开(公告)号： US20080173904A1公开(公告)日： 2008-07-24
- 发明人: Ming-Chyi Liu , Shih-Chi Fu , Yuan-Hung Liu , Wei-Chih Chen , Chi-Hsin Lo
- 申请人： Ming-Chyi Liu , Shih-Chi Fu , Yuan-Hung Liu , Wei-Chih Chen , Chi-Hsin Lo
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L27/148
- IPC分类号： H01L27/148
摘要：
A CMOS image sensor with a bonding pad comprises a semiconductor substrate having a pixel region and a circuit region; a passivation layer having an opening over the semiconductor substrate; and a bonding pad in circuit region, the bonding pad without extending to an upper surface of the passivation layer.
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