发明申请
- 专利标题： Memory card and manufacturing method of the same
- 专利标题（中）： 存储卡和制造方法相同
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申请号： US11898456申请日： 2007-09-12
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公开(公告)号： US20080173995A1公开(公告)日： 2008-07-24
- 发明人: Bunshi Kuratomi , Fukumi Shimizu , Michiaki Sugiyama , Atsushi Fujishima , Tamaki Wada
- 申请人： Bunshi Kuratomi , Fukumi Shimizu , Michiaki Sugiyama , Atsushi Fujishima , Tamaki Wada
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 优先权： JP2006-266453 20060929
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56
摘要：
There is a need to provide a large capacity memory card for a portable communication device. A memory card 1 includes: a wiring board 2 mainly composed of a glass epoxy resin; multiple semiconductor chips (3C and 3F) mounted on a main surface of the memory card 1; and a mold resin 4 for encapsulating the wiring board 2 and the semiconductor chips (3C and 3F). The mold resin 4 is made of a thermosetting epoxy resin containing quartz filler. A back surface of the wiring board 2 is not covered with the mold resin 4 and is exposed to a back surface of the memory card 1. The back surface of the wiring board 2 is used to form multiple external connection terminals 7 electrically connected to the semiconductor chips (3C and 3F) . When the memory card 1 is attached to a card slot of a mobile phone, the external connection terminals 7 contact with a connector terminal contained in the card slot. This makes it possible to exchange signals between the memory card 1 and the mobile phone or to supply the power.
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