发明申请
US20080179697A1 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
有权
电子设备包括MEMS器件和带孔衬底，特别是LGA或BGA型
- 专利标题： Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
- 专利标题（中）： 电子设备包括MEMS器件和带孔衬底，特别是LGA或BGA型
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申请号： US12006819申请日： 2008-01-04
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公开(公告)号： US20080179697A1公开(公告)日： 2008-07-31
- 发明人: Mario Cortese , Mark Anthony Azzopardi , Edward Myers , Chantal Combi , Lorenzo Baldo
- 申请人： Mario Cortese , Mark Anthony Azzopardi , Edward Myers , Chantal Combi , Lorenzo Baldo
- 申请人地址： IT Agrate Brianza (MI) MT Kirkop
- 专利权人： STMicroelectronics S.r.I.,STMicroelectronics (Malta) Ltd.
- 当前专利权人： STMicroelectronics S.r.I.,STMicroelectronics (Malta) Ltd.
- 当前专利权人地址： IT Agrate Brianza (MI) MT Kirkop
- 优先权： ITMI2007A000007 20070104; ITMI2007A000008 20070104
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/58
摘要：
An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.