An anti-impact memory module mainly comprises a multi-layer PWB (Printed Wiring Board), a plurality of memory packages and a plurality of first anti-impact bars. The PWB has two longer sides and two shorter sides. A plurality of gold fingers are disposed along one of the longer sides. The first anti-impact bars are disposed on one surface of the PWB and adjacent to the two shorter sides, which are higher than the memory packages in height. Preferably, at least a second anti-impact bar is formed at another longer side far away from the gold fingers. The first anti-impact bars and/or the second anti-impact bar can be utilized to cushion impact force for preventing the memory module product from damaging while fallen accidentally.