发明申请
- 专利标题： MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL VOID FORMATION IN SOLDER JOINTS
- 专利标题（中）： 焊接合金组合物的改性以抑制焊接接头中的界面失控
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申请号： US11669076申请日： 2007-01-30
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公开(公告)号： US20080182124A1公开(公告)日： 2008-07-31
- 发明人: Peter A. Gruber , Donald W. Henderson , Sung K. Kang , Da-Yuan Shih
- 申请人： Peter A. Gruber , Donald W. Henderson , Sung K. Kang , Da-Yuan Shih
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 主分类号： B32B15/00
- IPC分类号： B32B15/00 ; B23K1/00
摘要：
A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0 % by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.
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