公开(公告)号：US08157158B2

公开(公告)日：2012-04-17

申请号：US11669076

申请日：2007-01-30

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： B23K31/00

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及从包含Sn-Ag-Cu焊料，Sn-Cu焊料和Sn-Ag焊料的组中选择的含铅或无铅焊料，其粘附到焊料捕获垫上; 选自包含0.1至6.0重量％Zn的组的焊料。 一种焊接接头，包括在具有电路的基板上的焊料捕捉垫; 并且Sn-Cu无铅焊料粘附到焊料捕获垫，焊料包含0.1至6.0重量％的Zn。 阻止在焊料和焊料捕获垫之间的界面处形成空隙。 一种使用焊料形成焊点的方法。

公开(公告)号：US20120205425A1

公开(公告)日：2012-08-16

申请号：US13447906

申请日：2012-04-16

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： B23K1/20

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及从包含Sn-Ag-Cu焊料，Sn-Cu焊料和Sn-Ag焊料的组中选择的含铅或无铅焊料，其粘附到焊料捕获垫上; 选自包含0.1至6.0重量％Zn的组的焊料。 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 并且Sn-Cu无铅焊料粘附到焊料捕获垫，焊料包含0.1至6.0重量％的Zn。 阻止在焊料和焊料捕获垫之间的界面处形成空隙。 一种使用焊料形成焊点的方法。

公开(公告)号：US20120201596A1

公开(公告)日：2012-08-09

申请号：US13447888

申请日：2012-04-16

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： H01L23/14

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 percent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0% by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

公开(公告)号：US20080182124A1

公开(公告)日：2008-07-31

申请号：US11669076

申请日：2007-01-30

申请人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

发明人： Peter A. Gruber ,  Donald W. Henderson ,  Sung K. Kang ,  Da-Yuan Shih

IPC分类号： B32B15/00 ,  B23K1/00

CPC分类号： B23K35/262 ,  H05K3/3463 ,  Y10T403/479 ,  Y10T428/12708

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead containing or a lead free solder selected from the group comprising Sn—Ag—Cu solder, Sn—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 and 6.0 per cent by weight Zn. A solder joint, comprising a solder capture pad on a substrate having a circuit; and a Sn—Cu lead free solder adhered to the solder capture pad, the solder comprising between 0.1 and 6.0 % by weight Zn. Formation of voids at an interface between the solder and the solder capture pad is suppressed. A method for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及从包含Sn-Ag-Cu焊料，Sn-Cu焊料和Sn-Ag焊料的组中选择的含铅或无铅焊料，其粘附到焊料捕获垫上; 选自包含0.1至6.0重量％Zn的组的焊料。 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 并且Sn-Cu无铅焊料粘附到焊料捕获垫，焊料包含0.1至6.0重量％的Zn。 阻止在焊料和焊料捕获垫之间的界面处形成空隙。 一种使用焊料形成焊点的方法。

公开(公告)号：US20090197114A1

公开(公告)日：2009-08-06

申请号：US12254790

申请日：2008-10-20

申请人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

发明人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

IPC分类号： B32B15/01 ,  B23K1/20

CPC分类号： B23K1/008 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  C22C13/00 ,  H01L2224/16225 ,  H05K3/3463 ,  Y10T428/12708 ,  Y10T428/12715

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

公开(公告)号：US20090197103A1

公开(公告)日：2009-08-06

申请号：US12254768

申请日：2008-10-20

申请人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

发明人： Da-Yuan Shih ,  Donald W. Henderson ,  Sung K. Kang ,  Minhua Lu ,  Jae-Woong Nah ,  Kamalesh Srivastava

IPC分类号： B32B15/04 ,  B23K1/20 ,  C22C13/00

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K2101/42 ,  C22C13/00 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05613 ,  H01L2224/05618 ,  H01L2224/0562 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/14 ,  H01L2924/35121 ,  H01L2924/3656 ,  H05K3/3463 ,  Y10T428/31678 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01082 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/01051 ,  H01L2924/00

摘要： A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

摘要翻译： 一种焊接接头，包括在具有电路的基板上的焊料捕获垫; 以及选自Sn-Ag-Cu焊料和Sn-Ag焊料的焊料的无铅焊料粘附到焊料捕获垫上; 选自包含0.1至2.0重量％的Sb或Bi和0.5至3.0％Ag的组的焊料。 焊料和焊料捕捉垫之间的界面上的空隙形成通过包含Zn而被抑制。 层间电介质分层被抑制，电迁移特性大大提高。 使用焊料形成焊点的方法。

公开(公告)号：US06805974B2

公开(公告)日：2004-10-19

申请号：US10078020

申请日：2002-02-15

申请人： Won K. Choi ,  Charles C. Goldsmith ,  Timothy A. Gosselin ,  Donald W. Henderson ,  Sung K. Kang ,  Karl J. Puttlitz, Sr. ,  Da-Yuan Shih

发明人： Won K. Choi ,  Charles C. Goldsmith ,  Timothy A. Gosselin ,  Donald W. Henderson ,  Sung K. Kang ,  Karl J. Puttlitz, Sr. ,  Da-Yuan Shih

IPC分类号： B23K3526

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K2101/36 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

摘要： A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

摘要翻译： 焊料组成及相关的形成方法。 焊料组合物包括基本上无铅的合金，其包括锡（Sn），银（Ag）和铜。 锡在合金中的重量百分比浓度至少为约90％。 银在合金中具有重量百分比浓度X. X足够小，当液态的合金通过冷却至固相Sn相成核的较低温度而固化时，基本上抑制了Ag 3 Sn板的形成。 该较低温度对应于相对于合金的共晶熔融温度的过冷度差ΔT。 或者，X可以为约4.0％以下，其中液化合金以足够高的冷却速度被冷却，以基本上抑制合金中的Ag 3 Sn板的形成。 铜在合金中的重量百分比浓度不超过约1.5％。

公开(公告)号：US07703661B2

公开(公告)日：2010-04-27

申请号：US11752382

申请日：2007-05-23

申请人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

发明人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

IPC分类号： B23K35/24

CPC分类号： B23K1/19 ,  B23K35/262 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215

摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduced or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

摘要翻译： 简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以痕量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷却温度特性的焊料组合物。 该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。 将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。 因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。 这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。

公开(公告)号：US20080290142A1

公开(公告)日：2008-11-27

申请号：US11752382

申请日：2007-05-23

申请人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

发明人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

IPC分类号： B23K35/24 ,  B23K101/36 ,  B23K31/02

CPC分类号： B23K1/19 ,  B23K35/262 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215

摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.

摘要翻译： 简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。 该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。 将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。 因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。 这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。 此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。 此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。

公开(公告)号：US07784669B2

公开(公告)日：2010-08-31

申请号：US12536122

申请日：2009-08-05

申请人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

发明人： Gareth G. Hougham ,  Kamalesh K. Srivastava ,  Sung K. Kang ,  Da-Yuan Shih ,  Brian R. Sundlof ,  S. Jay Chey ,  Donald W. Henderson ,  David R. Di Milia ,  Richard P. Ferlita ,  Roy A. Carruthers

IPC分类号： B23K35/24

CPC分类号： B23K1/19 ,  B23K35/262 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215

摘要： Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state. Further, the addition of a trace amount of nucleation sites within the composition facilitates control over the number, size, and orientations of primary intermetallic compounds in tin rich crystallite grains. Moreover, trace amounts of one or more solid and/or insoluble nucleating modifiers within a given volume of solder reduces the size of average crystallites within the composition.

摘要翻译： 简而言之，公开了一种新颖的材料方法，其中将一种或多种成核改性剂以微量添加到无铅富锡焊料合金中以产生具有降低或抑制的过冷温度特性的焊料组合物。 该改性剂是有助于减少与体心四方锡锡基无铅焊料相关的极端各向异性的物质。 将成核改性剂添加到焊料合金中不会实质上影响焊料组合物的熔点。 因此，具有成核组合物的焊料球冻结，而阵列内的其它焊球保持在熔体中。 这有效地使一个基板通过一个或多个预定的焊球被固定到另一个基板，以固定封装，而剩余的焊点处于液态。 此外，在组合物中添加微量的成核位点有助于控制富锡微晶颗粒中初级金属间化合物的数量，尺寸和取向。 此外，在给定体积的焊料中痕量的一种或多种固态和/或不溶性成核改性剂减少了组合物内平均微晶的尺寸。