发明申请
US20080182183A1 REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY 有权
反射掩蔽空白用于EUV LITHOGRAPHY

REFLECTIVE MASK BLANK FOR EUV LITHOGRAPHY
摘要:
To provide a reflective mask blank for EUV lithography having an absorber layer which has a low reflectance in a wavelength region of EUV light or light for inspection of a pattern and which is easy to control to have a desired layer composition and thickness.A reflective mask blank for EUV lithography, which comprises a substrate, and a reflective layer to reflect EUV light and an absorber layer to absorb EUV light, formed in this order on the substrate, wherein the absorber layer contains tantalum (Ta) and hafnium (Hf), and in the absorber layer, the content of Hf is from 20 to 60 at. % and the content of Ta is from 40 to 80 at. %, and wherein the absorber layer has a content of N being 0 to at most 35 at. %.
公开/授权文献
信息查询
0/0