发明申请
- 专利标题: HEATING DEVICE, HEATING METHOD AND STORAGE MEDIUM
- 专利标题(中): 加热装置,加热方法和储存介质
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申请号: US12020898申请日: 2008-01-28
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公开(公告)号: US20080182217A1公开(公告)日: 2008-07-31
- 发明人: Tetsuo Fukuoka , Takahiro Kitano , Kazuo Terada
- 申请人: Tetsuo Fukuoka , Takahiro Kitano , Kazuo Terada
- 申请人地址: JP Tokyo-To
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo-To
- 优先权: JP2007-021355 20070131
- 主分类号: F27D15/02
- IPC分类号: F27D15/02 ; F27D3/00
摘要:
A heating device 1 includes a flat heating chamber 3 provided with a side opening. A substrate W is carried in a horizontal position through the side opening into the processing chamber 3, and is subjected to a heating process in the heating chamber 3. the heating chamber 3 is provided with heating plates 34 and 35 respectively provided with heating elements 34a and 35a, and a cooling mechanism 2 for cooling the heating plates 34 and 35. A controller 7 controls the cooling mechanism such that the heating plates 34 and 35 are cooled after the completion of the heating process for heating the substrate W and before a succeeding substrate W is carried into the heating chamber 3, and controls the heating elements 34a and 35a such that the heating plates 34 and 35 are heated at a processing temperature after the succeeding substrate has been carried into the heating chamber 3.