发明申请
- 专利标题: Electromagnetic bandgap structure and printed circuit board
- 专利标题(中): 电磁带隙结构和印刷电路板
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申请号: US12010872申请日: 2008-01-30
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公开(公告)号: US20080185179A1公开(公告)日: 2008-08-07
- 发明人: Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
- 申请人: Han Kim , Jae-Joon Lee , Mi-Ja Han , Dae-Hyun Park
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0010364 20070201; KR10-2007-0093956 20070917
- 主分类号: H05K1/11
- IPC分类号: H05K1/11
摘要:
Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.
公开/授权文献
- US08035991B2 Electromagnetic bandgap structure and printed circuit board 公开/授权日:2011-10-11
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