公开(公告)号：US20080185179A1

公开(公告)日：2008-08-07

申请号：US12010872

申请日：2008-01-30

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

摘要翻译： 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US08422248B2

公开(公告)日：2013-04-16

申请号：US13137504

申请日：2011-08-22

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

摘要翻译： 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US20110303452A1

公开(公告)日：2011-12-15

申请号：US13137504

申请日：2011-08-22

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K1/11

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

摘要翻译： 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US08035991B2

公开(公告)日：2011-10-11

申请号：US12010872

申请日：2008-01-30

申请人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

发明人： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC分类号： H05K9/00

CPC分类号： H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

摘要翻译： 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。

公开(公告)号：US07965521B2

公开(公告)日：2011-06-21

申请号：US12010558

申请日：2008-01-25

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

IPC分类号： H05K9/00

CPC分类号： H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

公开(公告)号：US20080266026A1

公开(公告)日：2008-10-30

申请号：US12010558

申请日：2008-01-25

申请人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

发明人： Mi-Ja Han ,  Han Kim ,  Dae-Hyun Park ,  Jae-Joon Lee

IPC分类号： H03H7/00

CPC分类号： H01P1/2005 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

摘要翻译： 公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。 这里，可以在金属板上形成孔。 利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

公开(公告)号：US20110214723A1

公开(公告)日：2011-09-08

申请号：US12842674

申请日：2010-07-23

申请人： Jeung-Ku Kang ,  Ga-In Lee ,  Weon-Ho Shin ,  Jae-Joon Lee ,  Narayan Chandra Deb Nath ,  Subrata Sarker

发明人： Jeung-Ku Kang ,  Ga-In Lee ,  Weon-Ho Shin ,  Jae-Joon Lee ,  Narayan Chandra Deb Nath ,  Subrata Sarker

IPC分类号： H01L31/0288 ,  H01L31/18

CPC分类号： H01G9/2031 ,  B82Y30/00 ,  H01L31/1884 ,  H01L51/002 ,  H01L51/0048 ,  H01L51/444 ,  Y02E10/542 ,  Y02E10/549 ,  Y10S977/749 ,  Y10S977/948

摘要： Provided are a dye-sensitized solar cell and a method for manufacturing the dye-sensitized solar cell using a carbon nanotube (CNx) doped with nitrogen, wherein the dye-sensitized solar cell using the carbon nanotube (CNx) doped with nitrogen has an improved conductivity and open circuit voltage as compared to those using the carbon nanotube (CNT) and also a high connectivity between a transparent electrode and an oxide semiconductor

摘要翻译： 提供染料敏化太阳能电池和使用掺杂有氮的碳纳米管（CNx）制造染料敏化太阳能电池的方法，其中使用掺杂有氮的碳纳米管（CNx）的染料敏化太阳能电池具有改进的 导电性和开路电压，与使用碳纳米管（CNT）的电导率和开路电压相比，以及透明电极和氧化物半导体之间的高连通性

公开(公告)号：US20090283302A1

公开(公告)日：2009-11-19

申请号：US12318748

申请日：2009-01-07

申请人： Seok-Kyu Lee ,  Shuhichi Okabe ,  Seung-Hyun Cho ,  Jae-Joon Lee

发明人： Seok-Kyu Lee ,  Shuhichi Okabe ,  Seung-Hyun Cho ,  Jae-Joon Lee

IPC分类号： H05K1/00 ,  H05K3/46 ,  H05K3/22

CPC分类号： H05K3/4682 ,  H05K1/0271 ,  H05K3/181 ,  H05K3/20 ,  H05K3/28 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0156

摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer.

摘要翻译： 公开了一种印刷电路板及其制造方法。 根据本发明的印刷电路板包括：电路层叠体，层叠在电路层叠体上的阻焊剂，形成在阻焊剂上的金属支撑层，形成在金属支撑层上的加强件。

公开(公告)号：US20100126765A1

公开(公告)日：2010-05-27

申请号：US12569104

申请日：2009-09-29

申请人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

发明人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

IPC分类号： H05K1/11 ,  B32B38/00 ,  B32B38/10 ,  C23F1/00

CPC分类号： H05K3/4007 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  Y10T156/1168

摘要： A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.

摘要翻译： 一种制造具有形成在一侧上的外部接触焊盘的多层PCB的方法可以包括：形成最外绝缘层，其中形成对应于外部接触焊盘的开口; 形成掩模，其中在最外绝缘层上形成对应于外部接触焊盘和电路图案的开口; 在外绝缘层的开口和掩模的开口中形成外部接触焊盘和电路图案; 去除面膜; 通过在最外层绝缘层上层叠层来形成堆积层，使得覆盖外部接触焊盘和电路图案; 在积层上形成第一阻焊层; 以及在最外绝缘层的相对侧上形成第二阻焊层; 以及在所述第二阻焊层中形成开口，使得所述外部接触焊盘露出。

公开(公告)号：US20090073670A1

公开(公告)日：2009-03-19

申请号：US12076358

申请日：2008-03-17

申请人： Jong-Kuk Hong ,  Jin-Yong An ,  Jae-Joon Lee

发明人： Jong-Kuk Hong ,  Jin-Yong An ,  Jae-Joon Lee

IPC分类号： H05K1/14 ,  H05K3/10 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/0271 ,  H05K1/09 ,  H05K3/205 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/09781 ,  H05K2203/0152 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.

摘要翻译： 公开了一种多层印刷电路板及其制造方法。 一种方法，其包括在载体上形成至少一个电路图案的重复处理和覆盖电路图案的至少一个绝缘层，并且在具有通孔的不同层上互连电路图案; 在绝缘层上堆叠金属加强件; 在加强件上形成至少一个绝缘层和至少一个电路图案的重复工艺，并且在具有通孔的不同层上互连电路图案; 并拆卸载体，可用于减少电路板翘曲，提高可加工性。