发明申请
- 专利标题: Semiconductor devices and fabrication methods thereof
- 专利标题(中): 半导体器件及其制造方法
-
申请号: US11703678申请日: 2007-02-08
-
公开(公告)号: US20080191276A1公开(公告)日: 2008-08-14
- 发明人: Chi-Chih Chen , Yi-Chun Lin , Kuo-Ming Wu , Ruey-Hsin Liu
- 申请人: Chi-Chih Chen , Yi-Chun Lin , Kuo-Ming Wu , Ruey-Hsin Liu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L21/336
摘要:
Semiconductor devices and fabrication methods thereof. The semiconductor device includes a semiconductor substrate with a body region of a first doping type. A gate structure is patterned on the semiconductor substrate. A single spacer is formed on a first sidewall of the gate structure. A body region of a first doping type is formed in the semiconductor substrate adjacent to a second sidewall of the gate structure. A source region of a second doping type is formed on the body region and having an edge aligned with the second sidewall of the gate structure. A drain region of the second doping type is formed on the semiconductor substrate and having an edge aligned with an exterior surface of the single sidewall.
信息查询
IPC分类: