An integrated circuit package having large conductive area and method for fabricating the same is provided. The package includes an integrated circuit chip having upper and lower surfaces and a photosensitive device formed on the upper surface. A bonding pad is subsequently formed on the upper surface of the integrated circuit chip and electrically connected to the photosensitive device. A conductive layer is then formed on a sidewall of the integrated circuit chip and wrapped around an edge of the bonding pad to electrically connect to the bonding pad. In the package, the conductive layer is in contact with the upper and lower surfaces and a sidewall of the bonding pad. Because the conductive layer is wrapped around the edge of the bonding pad, contact surface and structural strength between the conductive layer and the bonding pad are increased.