发明申请
US20080197381A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开
半导体器件及其制造方法

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
摘要:
A semiconductor device is provided with a vertical MOSFET including an N-type drift region that has a {110} crystal plane serving as the main surface thereof, a trench gate structure formed in a trench that has a {100} crystal plane serving as a sidewall surface thereof, and plural P-type column region structures provided in the N-type drift region 3, making up the super-junction structure. The P-type column region structures are disposed so as to be separated from each other in a plan view, and each of the plurality of column structures includes a plurality of column regions of the second conductivity type separated from each other in a cross-sectional view. By applying ion implantation of a P-type dopant to the main surface from a direction vertical to the main surface, the P-type column regions are formed down to sufficiently deeper positions in the drift region due to channeling. By so doing, it is possible to obtain a semiconductor device with an enhanced breakdown voltage. Further, since it is possible that a crystal plane of a channel is the {100} crystal plane, enabling a maximum electron mobility to be obtained, it is possible to increase on-current, so that on-resistance can be reduced.
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