Invention Application
- Patent Title: Sensor Assembly
- Patent Title (中): 传感器装配
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Application No.: US11996163Application Date: 2006-07-20
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Publication No.: US20080202235A1Publication Date: 2008-08-28
- Inventor: Larry D. Laps , Scott Warren , Ernie Wanner , Robert D. Ringle , Timothy J. Krabill , Greg Piotrowski
- Applicant: Larry D. Laps , Scott Warren , Ernie Wanner , Robert D. Ringle , Timothy J. Krabill , Greg Piotrowski
- Applicant Address: US OH Canton
- Assignee: THE TIMKEN COMPANY
- Current Assignee: THE TIMKEN COMPANY
- Current Assignee Address: US OH Canton
- International Application: PCT/US06/28421 WO 20060720
- Main IPC: G01D11/24
- IPC: G01D11/24

Abstract:
A sensor assembly. A sensor assembly 34 that has a sensing element 26 is mountable in a housing 5. The housing has an inner surface 12, an outer surface 14, a bore 16 disposed there through and further has a sensed object 24 positioned across a gap from the sensing element 26. The sensor assembly 34 comprises a sensor body 35 having a first portion 36 and a second portion 38, the first portion 36 and the second portion 38 being positioned within the bore 16. The second portion 38 positions the sensing element 26 at an end of the second portion 38. The sensor assembly 34 further comprises an anti-corrosion member 56 positioned within the bore 16. Additionally, the sensor assembly 34 comprises a retaining member 58 removably fastened to the first portion 36 wherein the retaining member 58 such that the anti-corrosion member 56 isolates the sensing element 26 from the outer surface 14 to prevent contaminants from contacting the sensing element 26.
Information query